Leadframe, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

• US 20030071333A1
• Filed: 10/01/2002
• Published: 04/17/2003
• Est. Priority Date: 10/15/2001
• Status: Abandoned Application

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: Matsuzawa, Hideki
• Application Number:
  US10/260,571
• Publication Number:
  US 20030071333A1
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: H01L 21/4821 Flat leads, e.g. lead frames with or without insulating supports
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A leadframe for use in a leadless package (a semiconductor device) such as a quad flat non-leaded package (QFN) includes a base frame having a die-pad demarcated severally to correspond to each semiconductor element to be mounted thereon and a plurality of leads arranged around the corresponding die-pad, and an adhesive tape attached to the base frame so as to cover one surface side of each die-pad and the plurality of leads arranged around the corresponding die-pad. The plurality of leads corresponding to each die-pad extend with a comb shape from the corresponding die-pad to an outward direction, with being separated severally from the die-pad, inside a region to be ultimately divided into a semiconductor device. The leadframe further includes a plurality of support bars severally linked to each die-pad. The support bars are supported by the adhesive tape, and extend close to a peripheral portion of the region to be ultimately divided into the semiconductor device.

Claims

1. A leadframe comprising:

a base frame including a die-pad demarcated severally to correspond to each semiconductor element to be mounted thereon, and a plurality of leads arranged around the corresponding die-pad;

an adhesive tape attached to said base frame so as to cover one surface side of each die-pad and the plurality of leads arranged around the corresponding die-pad; and

said plurality of leads corresponding to each die-pad extending with a comb shape from the corresponding die-pad to an outward direction, with being separated severally from the die-pad, inside a region to be ultimately divided into a semiconductor device.

2. The leadframe according to claim 1, further comprising a plurality of support bars severally linked to each die-pad, the support bars being supported by said adhesive tape, and extending close to a peripheral portion of the region to be ultimately divided into the semiconductor device.

3. The leadframe according to claim 1, wherein said plurality of leads corresponding to each die-pad are used as external connection terminals when the leadframe is ultimately divided into respective semiconductor devices, and the leads are exposed to the side of a mounting surface of the corresponding semiconductor device.

10. A method of manufacturing a semiconductor device using the leadframe according to any one of claims 1 and 2, the method comprising the steps of:

mounting semiconductor elements on the respective die-pads of the leadframe;

electrically connecting electrodes of the semiconductor elements to the corresponding plurality of leads of said leadframe with bonding wires;

sealing the semiconductor elements, the bonding wires and the plurality of leads with molding resin from the side of a surface where the semiconductor elements are mounted, of said leadframe;

peeling off said adhesive tape; and

cutting the leadframe sealed with molding resin along outer perimeters of regions severally including the plurality of leads corresponding to each die-pad so as to form respective semiconductor devices.

11. The method according to claim 10, wherein said sealing with molding resin is performed by a mass molding in which an entire surface of the leadframe on the side where the semiconductor elements are mounted is sealed with resin.

4. A method of manufacturing a leadframe, comprising the steps of:

forming a base frame having an arrangement of die-pads provided for respective semiconductor elements to be mounted thereon and a plurality of leads being linked to the corresponding die-pad and extending with a comb shape to an outward direction, by etching or stamping a metal plate;

forming concave portions by half-etching at portions where said plurality of leads are linked to the corresponding die-pad, of one surface of said base frame;

attaching an adhesive tape to a surface of the side on which said concave portions are formed, of said base frame; and

cutting portions where said concave portions are formed, of said plurality of leads.

5. The method according to claim 4, further comprising the steps of:

forming a plurality of support bars in the step of forming a base frame, in such a manner that one end of each of the support bars is linked to an outer frame portion of the base frame and another end thereof is linked to the corresponding die-pad;

forming additional concave portions in the step of forming concave portions, by half-etching from one surface side of the base frame, at portions of the respective support bars to be detached from the outer frame portion of the base frame when the leadframe is ultimately divided into respective semiconductor devices; and

cutting portions where said additional concave portions are formed, of said plurality of support bars, after the step of attaching an adhesive tape.

6. The method according to claim 4, between the step of forming concave portions and the step of attaching an adhesive tape, further comprising the step of forming a metal film on an entire surface of said base frame by electrolytic plating.

7. A method of manufacturing a leadframe, comprising the steps of:

forming a base frame having an arrangement of die-pads provided for respective semiconductor elements to be mounted thereon and a plurality of leads being linked to the corresponding die-pad and extending with a comb shape to an outward direction, and simultaneously forming concave portions at portions where said plurality of leads are linked to the corresponding die-pad, of one surface of said base frame, by using resists patterned into predetermined shapes on both surfaces of a metal plate and simultaneously etching the both sides of the metal plate;

attaching an adhesive tape to a surface of the side on which said concave portions are formed, of said base frame; and

cutting portions where said concave portions are formed, of said plurality of leads.

8. The method according to claim 7, further comprising the steps of:

forming a plurality of support bars in the step of forming a base frame, in such a manner that one end of each of the support bars is linked to an outer frame portion of the base frame and another end thereof is linked to the corresponding die-pad;

forming additional concave portions in the step of forming concave portions, by half-etching from one surface side of the base frame, at portions of the respective support bars to be detached from the outer frame portion of the base frame when the leadframe is ultimately divided into respective semiconductor devices; and

cutting portions where said additional concave portions are formed, of said plurality of support bars, after the step of attaching an adhesive tape.

9. The method according to claim 7, between the step of forming concave portions and the step of attaching an adhesive tape, further comprising the step of forming a metal film on an entire surface of said base frame by electrolytic plating.