MEMS capping method and apparatus
First Claim
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1. A method for capping a Micro-Electromechanical System (MEMS) device, the method comprising:
- forming a cap structure having a bottom side with at least a MEMS cavity, a cut capture cavity surrounding the MEMS cavity, and a cap wall, the cap wall forming an outer wall of the MEMS cavity and an inner wall of the cut capture cavity;
bonding the cap wall onto a MEMS structure; and
cutting through to the cut capture cavity from a top side of the cap structure to form a cap.
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Abstract
A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.
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Citations
18 Claims
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1. A method for capping a Micro-Electromechanical System (MEMS) device, the method comprising:
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forming a cap structure having a bottom side with at least a MEMS cavity, a cut capture cavity surrounding the MEMS cavity, and a cap wall, the cap wall forming an outer wall of the MEMS cavity and an inner wall of the cut capture cavity;
bonding the cap wall onto a MEMS structure; and
cutting through to the cut capture cavity from a top side of the cap structure to form a cap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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- 15. An apparatus for capping a Micro-Electromechanical System (MEMS) device, the apparatus comprising a bottom side with at least one MEMS cavity, cut capture cavity surrounding the MEMS cavity, and cap wall, the cap wall forming an outer wall of the MEMS cavity and an inner wall of the cut capture cavity.
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18. A capped Micro-Electromechanical System (MEMS) device produced by the process of forming a cap structure having a bottom side with at least a MEMS cavity, a cut capture cavity surrounding the MEMS cavity, and a cap wall, the cap wall forming an outer wall of the MEMS cavity and an inner wall of the cut capture cavity;
- bonding the cap wall onto a MEMS structure; and
cutting through to the cut capture cavity from a top side of the cap structure to form a cap.
- bonding the cap wall onto a MEMS structure; and
Specification