Led chip package with four led chips and intergrated optics for collimating and mixing the light

• US 20030076034A1
• Filed: 10/22/2001
• Published: 04/24/2003
• Est. Priority Date: 10/22/2001
• Status: Abandoned Application

• Current Assignee: Douglas Peter Woolverton, Frank Jeroen Pieter Schuurmans, Michael David Pashley, Thomas M. Marshall
• Original Assignee: Douglas Peter Woolverton, Frank Jeroen Pieter Schuurmans, Michael David Pashley, Thomas M. Marshall
• Inventors: Woolverton, Douglas Peter, Pashley, Michael David, Schuurmans, Frank Jeroen Pieter, Marshall, Thomas M.
• Application Number:
  US10/083,328
• Publication Number:
  US 20030076034A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A LED chip package including a base, an array of LED chips disposed on the base, and a collimator mounted on the base, over the array of light-emitting-diode chips. The LED chips of the array are typically arranged in an inline manner. The collimator is generally configured as a rectangular, horn-like member and typically includes a first set of walls that collimate the light emitted by the LED chips in a first direction and a second set of walls that minimally collimate the light emitted by the LED chips in a second direction.

Claims

1. A light-emitting-diode chip package comprising:

a base;

an array of light-emitting-diode chips disposed on the base; and

a collimator mounted on the base, over the array of light-emitting-diode chips.

2. The light-emitting-diode chip package according to claim 1, wherein the lightlight-emitting-diode chips are arranged in the array in an inline manner.

3. The light-emitting-diode chip package according to claim 2, wherein the light-emitting-diode chips at ends of the array emit the same color light.

4. The light-emitting-diode chip package according to claim 2, wherein the light-emitting-diode chips at ends of the array emit green light.

5. The light-emitting-diode chip package according to claim 2, wherein the light-emitting-diode chips include a light-emitting-diode chip that emits blue light, a light-emitting-diode chip that emits green light, and a light-emitting-diode chip that emits red light.

6. The light-emitting-diode chip package according to claim 5, wherein the array of light-emitting-diode chips produce a single unit of white light.

7. The light-emitting-diode chip package according to claim 1, wherein the light-emitting-diode chips include a light-emitting-diode chip that emits blue light, a light-emitting-diode chip that emits green light, and a light-emitting-diode chip that emits red light.

8. The light-emitting-diode chip package according to claim 1, wherein the array of light-emitting-diode chips produces a single unit of white light.

9. The light-emitting-diode chip package according to claim 1, wherein the collimator is generally configured as a rectangular, horn-like member.

10. The light-emitting-diode chip package according to claim 9, wherein the collimator includes a first set of walls that collimate the light emitted by the light-emitting-diode chips in a first direction and a second set of walls that minimally collimate the light emitted by the light-emitting-diode chips in a second direction.

11. The light-emitting-diode chip package according to claim 1, wherein the collimator includes a first set of walls that collimate the light emitted by the light-emitting-diode chips in a first direction and a second set of walls that minimally collimate the light emitted by the light-emitting-diode chips in a second direction.

12. The light-emitting-diode chip package according to claim 1, wherein the base is adapted for bonding lead wires.

13. A light source comprising:

at least two light-emitting-diode chip packages;

each of the light-emitting-diode chip packages including;

a base;

an array of light-emitting-diode chips disposed on the base; and

a collimator mounted on the base, over the array of light-emitting-diode chips.

14. The light source according to claim 13, wherein the light-emitting-diode chips are arranged in each of the arrays in an inline manner.

15. The light source according to claim 13, wherein each of the arrays of light-emitting-diode chips includes a light-emitting-diode chip that emits blue light, a light-emitting-diode chip that emits green light, and a light-emitting-diode chip that emits red light.

16. The light source according to claim 13, wherein each of the arrays of light-emitting-diode chips produces a single unit of white light.

17. The light source according to claim 13, wherein each of the collimators is generally configured as a rectangular, horn-like member.

18. The light source according to claim 13, wherein each of the collimators includes a first set of walls that collimate the light emitted by their respective light-emitting-diode chips in a first direction and a second set of walls that minimally collimate the light emitted by their respective light-emitting-diode chips in a second direction.

19. The light source according to claim 13, wherein each of the bases is adapted for bonding lead wires.