×

Transponder and injection-molded part and method for manufacturing same

  • US 20030076662A1
  • Filed: 11/25/2002
  • Published: 04/24/2003
  • Est. Priority Date: 05/14/1999
  • Status: Abandoned Application
First Claim
Patent Images

1. An electrical circuit comprising an integrated circuit, an antenna and one or more electrical connections between the integrated circuit and the antenna, wherein at least the integrated circuit and the antenna are encapsulated within a capsule, and wherein the capsule comprises a thermoplastic resin having a melting point of from 120°

  • C. to 250°

    C.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×