Transponder and injection-molded part and method for manufacturing same
First Claim
1. An electrical circuit comprising an integrated circuit, an antenna and one or more electrical connections between the integrated circuit and the antenna, wherein at least the integrated circuit and the antenna are encapsulated within a capsule, and wherein the capsule comprises a thermoplastic resin having a melting point of from 120°
- C. to 250°
C.
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Accused Products
Abstract
A transponder contains an integrated circuit, a power transmitting component (antenna) and a capsule made of a thermoplastic resin (hot glue) that surrounds the circuit continuously at least on one surface of the circuit. The glue preferably is a polyamide and surrounds the circuit protectively, ensuring a mechanical connection between the circuit and the antenna. The encapsulation with the hot glue is conducted at pressures and temperatures that are below the pressures and temperatures encountered during conventional injection molding. The transponder can be integrated into an injection molded part, for example a coin, by being placed in an injection mold in which it is supported by feet and then surrounded by molding material in a conventional injection molding process so that it develops a more resistant sheath.
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Citations
28 Claims
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1. An electrical circuit comprising an integrated circuit, an antenna and one or more electrical connections between the integrated circuit and the antenna, wherein at least the integrated circuit and the antenna are encapsulated within a capsule, and wherein the capsule comprises a thermoplastic resin having a melting point of from 120°
- C. to 250°
C. - View Dependent Claims (2, 3, 4, 5)
- C. to 250°
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6. Transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120°
- C. to 250°
C., and wherein the-electrical circuit is encapsulated by the thermoplastic resin such that at least an integrated circuit and an antenna of the electrical circuit are encapsulated by the thermoplastic resin. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
- C. to 250°
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16. Method of manufacturing a transponder comprising an electrical circuit containing at least one component suitable for interaction with an electromagnetic field encapsulated within a capsule, wherein the capsule comprises a thermoplastic resin having a melting point of from 120°
- C. to 250°
C., and wherein the electrical circuit is encapsulated by the thermoplastic resin within the capsule such that at least an integrated circuit and an antenna of the electrical circuit are encapsulated by the thermoplastic resin, comprisingplacing at least one of the electrical circuits in a cavity of a mold, and feeding the thermoplastic resin in molten form into the cavity to encapsulate the at least one electrical circuit and form the capsule, wherein the feeding is conducted at a temperature of from 120°
C. to 260°
C. and at a pressure of from 5 to 40 bars. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
- C. to 250°
Specification