Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support

• US 20030077881A1
• Filed: 08/08/2002
• Published: 04/24/2003
• Est. Priority Date: 10/19/2001
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Pozzi, Stefano, Gelmi, Ilaria, Sassolini, Simone, Garavaglia, Massimo
• Granted Patent: US 6,696,364 B2
• Time in Patent Office: Days
• US Class Current: 438/464
• CPC Class Codes: B81C 1/0088 Separation allowing recovery of the substrate or a part of the substrate, e.g. epitaxial lift-off

Abstract

A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.

Claims

1. A method for processing MEMS devices integrated on a semiconductor wafer comprising:

bonding the semiconductor wafer comprising the MEMS devices onto a support;

dicing the semiconductor wafer into a plurality of independent MEMS devices on the support; and

processing the independent MEMS devices on the support in a treatment environment for semiconductor wafers.

2. The method according to claim 1 wherein bonding comprises positioning a bonding sheet between the semiconductor wafer and the support.

3. The method according to claim 1 wherein bonding comprises using an anhydrous HF-resistant glue.

4. The method according to claim 3 wherein processing comprises processing in an anhydrous HF solution.

5. The method according to claim 1 further comprising:

automatically picking the MEMS devices; and

automatically assembling the MEMS devices one-by-one.

6. The method according to claim 5 wherein automatically picking and assembling comprises using a pick and place apparatus.

7. The method according to claim 1 wherein the support comprises a flat frame support.

8. The method according to claim 1 wherein the support comprises a waffle package support.

9. The method according to claim 1 further comprising protecting at least one face of the support with a protection layer.

10. The method according to claim 1 wherein the steps are carried out in an apparatus for treating semiconductor wafers.

11. A method for making MEMS devices comprising:

forming a plurality of MEMS devices integrated on a semiconductor substrate;

bonding the semiconductor wafer comprising the MEMS devices onto a support using an anhydrous HF-resistant glue;

dicing the semiconductor wafer into a plurality of independent MEMS devices on the support; and

processing the independent MEMS devices on the support in an anhydrous HF solution.

12. The method according to claim 11 wherein bonding comprises positioning a bonding sheet between the semiconductor wafer and the support.

13. The method according to claim 11 further comprising:

automatically picking the MEMS devices; and

automatically assembling the MEMS devices one-by-one.

14. The method according to claim 13 wherein automatically picking and assembling comprises using a pick and place apparatus.

15. The method according to claim 11 wherein the support comprises a flat frame support.

16. The method according to claim 11 wherein the support comprises a waffle package support.

17. The method according to claim 11 further comprising protecting at least one face of the support with a protection layer.

18. The method according to claim 11 wherein the steps are carried out in an apparatus for treating semiconductor wafers.

19. A semiconductor assembly comprising:

a semiconductor wafer comprising a plurality of MEMS devices integrated therein;

a support adjacent said semiconductor wafer; and

a bonding layer securing said semiconductor wafer to said support.

20. The semiconductor assembly according to claim 19 further comprising a protection layer adjacent at least one face of said support.

21. The semiconductor assembly according to claim 20 wherein said protection layer comprises a gel layer.

22. The semiconductor assembly according to claim 19 wherein said support has a plurality of openings therein.

23. The semiconductor assembly according to claim 19 wherein said support comprises a metal plate.

24. The semiconductor assembly according to claim 19 further comprising a tray carrying said support, and an arm connected to said tray.

25. The semiconductor assembly according to claim 24 wherein said tray comprises at least one of metal and plastic.

26. The semiconductor assembly according to claim 19 wherein said support comprises a flat frame support.

27. The semiconductor assembly according to claim 19 wherein said support comprises a waffle package support.

28. The semiconductor assembly according to claim 19 wherein said bonding layer comprises an anhydrous HF-resistant bonding material.

29. A semiconductor assembly comprising:

a semiconductor wafer comprising a plurality of MEMS devices integrated therein;

a support adjacent said semiconductor wafer; and

a bonding layer securing said semiconductor wafer to said support, said bonding layer comprising an anhydrous HF-resistant bonding material; and

a protection layer adjacent at least one face of said support.

30. The semiconductor assembly according to claim 29 wherein said protection layer comprises a gel layer.

31. The semiconductor assembly according to claim 29 wherein said support has a plurality of openings therein.

32. The semiconductor assembly according to claim 29 wherein said support comprises a metal plate.

33. The semiconductor assembly according to claim 29 further comprising a tray carrying said support, and an arm connected to said tray.

34. The semiconductor assembly according to claim 33 wherein said tray comprises at least one of metal and plastic.

35. The semiconductor assembly according to claim 29 wherein said support comprises a flat frame support.

36. The semiconductor assembly according to claim 29 wherein said support comprises a waffle package support.