Method for connecting printed circuit boards and connected printed circuit boards
First Claim
1. A method for connecting a pair of printed circuit board comprising steps of:
- preparing a first printed circuit board by forming a first conductive pattern, which includes a first land, on a first insulating board substantially made of thermoplastic resin;
preparing a second printed circuit board by forming a second conductive pattern, which includes a second land, on a second insulating board;
forming a solder on one of the first and second lands;
overlapping the first and second printed circuit boards such that the first and second lands confront each other;
heat pressing an overlapped portion of the first and second printed circuit boards with a heat-pressing tool at a temperature higher than the glass transition temperature of the thermoplastic resin while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool to permit the thickness of the first insulating board to change gradually in the cooled area, wherein the first and second lands are electrically connected with the solder and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board at the step of heat pressing.
1 Assignment
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Accused Products
Abstract
A first printed circuit board includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern. A second printed circuit board includes a second insulating board and a second conductive pattern. The first and second printed circuit boards are overlapped. The overlapped portion of the first and second printed circuit boards is heat pressed to connect the first and second printed circuit boards with a heat-pressing tool while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool. With the heat pressing, the first and second lands are electrically connected and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board. The thickness of the first insulating board is preferably controlled at the heat pressed area and the area adjacent to the heat pressed area by the cooling.
38 Citations
22 Claims
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1. A method for connecting a pair of printed circuit board comprising steps of:
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preparing a first printed circuit board by forming a first conductive pattern, which includes a first land, on a first insulating board substantially made of thermoplastic resin;
preparing a second printed circuit board by forming a second conductive pattern, which includes a second land, on a second insulating board;
forming a solder on one of the first and second lands;
overlapping the first and second printed circuit boards such that the first and second lands confront each other;
heat pressing an overlapped portion of the first and second printed circuit boards with a heat-pressing tool at a temperature higher than the glass transition temperature of the thermoplastic resin while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool to permit the thickness of the first insulating board to change gradually in the cooled area, wherein the first and second lands are electrically connected with the solder and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board at the step of heat pressing. - View Dependent Claims (2, 3, 4)
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5. A method for connecting a pair of printed circuit board comprising steps of:
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preparing a first printed circuit board by forming a first conductive pattern, which includes a first land, on a first insulating board substantially made of thermoplastic resin;
preparing a second printed circuit board by forming a second conductive pattern, which includes a second land, on a second insulating board;
forming a solder on one of the first and second lands;
overlapping the first and second printed circuit boards such that the first and second lands confront each other;
heat pressing an overlapped portion of the first and second printed circuit boards with a heat-pressing tool having a plurality of projections at a temperature higher than the glass transition temperature of the thermoplastic resin such that the thickness of the first insulating board is smaller at areas pressed by the projections than the maximum thickness of the first insulating board at areas between the areas pressed by the projections, wherein the first and second lands are electrically connected with the solder and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board at the step of heat pressing. - View Dependent Claims (6, 7, 8)
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9. A method for connecting a pair of printed circuit board comprising steps of:
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preparing a first printed circuit board by forming a first conductive pattern, which includes a first land, on a first insulating board substantially made of thermoplastic resin;
preparing a second printed circuit board by forming a second conductive pattern, which includes a second land, on a second insulating board;
overlapping the first and second printed circuit boards such that the first and second lands confront each other;
heat pressing an overlapped portion of the first and second printed circuit boards with a heat-pressing tool at a temperature higher than the melting point of the thermoplastic resin while the first insulating board is cooled at an area adjacent to an area pressed by the heat-pressing tool during the step of heat pressing such that the temperature of the first insulating board is kept lower than the melting point at the area adjacent to the area pressed by the heat-pressing tool, wherein the first and second lands are electrically connected with the solder and the thermoplastic resin is softened and plastically deformed to bond the first insulating board to the second insulating board at the step of heat pressing. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A pair of connected printed circuit boards comprising:
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a first printed circuit board, which includes a first insulating board substantially made of thermoplastic resin and a first conductive pattern having a first land, wherein the first conductive pattern is located on the first insulating board; and
a second printed circuit board, which includes a second insulating board and a second conductive pattern having a second land, wherein the second conductive pattern is located on the second insulating board, wherein the first land is in electrical connect with the second land, wherein the thermoplastic resin of the first insulating board is in contact with the second insulating board in the proximity of the first and second lands, the thickness of the first insulating board on the first land is 20% or more of the thickness at the rest of the first insulating board.
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22. The pair of connected printed circuit boards claim in 21, wherein the thermoplastic resin includes one of polyethylenenaphthalate, polyethylenetelephthalate, polyetherimide, polyetheretherketone, and liquid crystal polymer.
Specification