Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
First Claim
1. A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by said LED chip and emits light of a different wavelength, wherein said fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, said fluorescent particles of large particle size being distributed in the vicinity of said LED chip in said light transmitting resin to form a wavelength converting layer, said fluorescent particles of small particle size being distributed on the outside of said wavelength converting layer in the light transmitting resin.
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Abstract
A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by the LED chip and emits light of a different wavelength, wherein the fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, the fluorescent particles of large particle size being distributed in the vicinity of the LED chip in the light transmitting resin to form a wavelength converting layer, the fluorescent particles of small particle size being distributed on the outside of the wavelength converting layer in the light transmitting resin.
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Citations
33 Claims
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1. A light emitting diode comprising an LED chip having a light emitting layer made of a nitride compound semiconductor and a light transmitting resin that includes a fluorescent material which absorbs at least a part of light emitted by said LED chip and emits light of a different wavelength,
wherein said fluorescent material includes a fluorescent particles of small particle size and a fluorescent particles of large particle size, said fluorescent particles of large particle size being distributed in the vicinity of said LED chip in said light transmitting resin to form a wavelength converting layer, said fluorescent particles of small particle size being distributed on the outside of said wavelength converting layer in the light transmitting resin.
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5. A light emitting diode comprising a LED chip made of a nitride semiconductor and a light transmitting resin having a fluorescent material which absorbs at least a part of light emitted by said LED chip and emits light of a different wavelength,
wherein said fluorescent material is characterized by a volume-based particle size distribution curve that is flat in a region of cumulative percentage from 0.01 to 10 vol %.
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11. A light emitting diode comprising;
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a package having a metal base consisting of a pair of thin metal sheets that constitute positive and negative electrodes being joined via a resin insulator for electrical isolation from each other and a side wall bonded to the circumference of said metal base on one side thereof thereby forming a mounting area, an LED chip mounted in said mounting area and, a light transmitting resin that fills the mounting area so as to seal the LED chip. wherein said light transmitting resin is formed continuously from said mounting area over the top of said side wall and the top surface of said light transmitting resin is flat and substantially parallel to said metal base and the side face on the circumference of the light transmitting resin is substantially flush with the circumferential side face of the package. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. An epoxy resin composition comprising;
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an epoxy resin containing an alicyclic epoxy resin, which accounts for 65% by weight or more of the epoxy resin, an acid anhydride represented by the general formula (1) or dicarboxylic acid represented by the general formula (2) in an amount of 0.005 to 1.5 mol based on an epoxy equivalent of the epoxy resin, and a cation curing agent in an amount of 0.0001 to 0.01 mol based on an epoxy equivalent of said epoxy resin. wherein R1 represents a cyclic or aliphatic alkyl or aryl having 0 to 12 carbon atoms and R2 represents an alkyl or aryl having 0 to 12 carbon atoms. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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- 27. A method for producing a fluorescent material comprising a step of firing a mixture of a stock material and a flux, wherein said step of firing includes a first firing process of firing in a first reducing atmosphere and a second firing process of firing in a second reducing atmosphere, said first reducing atmosphere having weaker reducing power than the second reducing atmosphere.
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31. A method for producing a fluorescent material comprising a step of firing a mixture of a stock material and a flux having barium fluoride, boric acid and a liquid.
Specification