Chip scale package with heat spreader and method of manufacture
First Claim
Patent Images
1. An assembly having a semiconductor die adhesively attached to a portion of a lead frame comprising:
- a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface;
at least one projection connected to at least one bond pad of said plurality of bond pads on the active surface of said semiconductor die for direct connection to a substrate, said at least one projection including one of at least one solder ball and at least one solder bump; and
a generally centrally positioned paddle of a lead frame of a plurality of lead frames having side rails and cross members connected to said paddle, said second surface of said semiconductor die being secured to said paddle;
said generally centrally positioned paddle being attached to the side rail by at least a plurality of paddle support bars and being attached to said cross members by said support bars.
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Abstract
A dense semiconductor flip-chip device is provided with a heat sink/spreading/dissipating member which is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Dice are bonded to the paddles by e.g. conventional die attach methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.
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Citations
39 Claims
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1. An assembly having a semiconductor die adhesively attached to a portion of a lead frame comprising:
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a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface;
at least one projection connected to at least one bond pad of said plurality of bond pads on the active surface of said semiconductor die for direct connection to a substrate, said at least one projection including one of at least one solder ball and at least one solder bump; and
a generally centrally positioned paddle of a lead frame of a plurality of lead frames having side rails and cross members connected to said paddle, said second surface of said semiconductor die being secured to said paddle;
said generally centrally positioned paddle being attached to the side rail by at least a plurality of paddle support bars and being attached to said cross members by said support bars. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An assembly having a semiconductor die adhesively attached to a portion of a lead frame comprising:
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a semiconductor die having an active surface having at least one bond pad thereon and an opposing second surface;
at least one projection secured to said at least one bond pad on said active surface of said semiconductor die for direct connection to a substrate, said at least one projection including one of at least one solder ball and at least one solder bump; and
a metal paddle from a lead frame, said second surface of said semiconductor die being attached to said paddle; and
said metal paddle is attached to at least one side rail by at least a plurality of paddle support bars and being attached to a plurality of cross members by said support bars. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An assembly having a semiconductor die and a portion of a lead frame comprising:
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a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface;
a plurality of projections connected to said plurality of bond pads directly for connection to a host circuit board, said plurality of projections including one of a plurality of solder balls and a plurality of solder bumps; and
a metallic paddle secured to said second surface of said semiconductor die, said metallic paddle being attached to at least one side rail by at least a plurality of paddle support bars and being attached to a plurality of cross members by said support bars. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification