Method for improving the power handling capacity of MEMS switches

• US 20030080839A1
• Filed: 10/31/2001
• Published: 05/01/2003
• Est. Priority Date: 10/31/2001
• Status: Abandoned Application

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Wong, Marvin Glenn
• Application Number:
  US10/004,032
• Publication Number:
  US 20030080839A1
• Time in Patent Office: Days
• US Class Current: 335/78
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01H 9/52 Cooling of switch parts cooling of contacts H01H1/62

Abstract

According to the present invention, an assembly and method is provided for preventing beams or switch contacts from overheating due to high power environments. A MEMS switch is packaged so that the beam and switch is surrounded by an inert, low viscosity, dielectric fluid. Utilizing such a construction conductively and convectively dissipates heat generated by resistive heating of the MEMS beam.

Claims

1. A micromachined electromagnetic switch comprising:

a dielectric substrate;

a deflecting beam connected to said substrate;

a first signal path plate connected to said beam;

a second signal path plate connected to said substrate;

an actuator plate connected to said beam; and

an attracted plate connected to said beam;

wherein a packaging connected to said forms a chamber surrounding said micromachined electromagnetic switch and wherein said chamber is filled with dielectric perfluorocarbon.

2. The micromachined electromagnetic switch of claim 1, wherein said perfluorocarbon is a substantially inert fluid.

3. The micromachined electromagnetic switch of claim 2, wherein said fluid has a low viscosity.

4. The micromachined electromagnetic switch of claim 3, wherein said deflecting beam is a cantilever beam.

5. The micromachined electromagnetic switch of claim 3, wherein said deflecting beam is a beam fixed at both ends.

6. The micromachined electromagnetic switch of claim 3, wherein there are perforations present in said deflecting beam, said attracted plate and said first signal path plate.

7. A micromachined electromagnetic switch for switching electrical signals comprising a deflecting beam and an actuating means for switching said electrical signals, wherein said micromachined electromagnetic switch is surrounded by a dielectric substance, said substance providing an airtight chamber which is filled with a dielectric fluid.

8. The micromachined electromagnetic switch of claim 7 wherein said fluid is a perfluorocarbon.

9. The micromachined electromagnetic switch of claim 8 wherein said perfluorocarbon is substantially inert, has a low viscosity and has a low molecular weight.

10. The micromachined electromagnetic switch of claim 7, wherein said deflecting beam is a cantilever beam.

11. The micromachined electromagnetic switch of claim 7 wherein said deflecting beam is a beam have a first and a second end and which is fixed at said first and said second end.