Information containing means for memory modules and memory chips

• US 20030081444A1
• Filed: 10/23/2002
• Published: 05/01/2003
• Est. Priority Date: 10/26/2001
• Status: Active Grant

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Qimonda AG (Infineon Technologies AG)
• Inventors: Taskin, Nazif, Stocken, Christian, Wirth, Norbert, Cordes, Eric
• Granted Patent: US 7,260,671 B2
• Time in Patent Office: Days
• US Class Current: 365/96
• CPC Class Codes: G11C 16/20 Initialising; Data preset; Chip identification
• CPC Class Codes: G11C 5/04 Supports for storage elements , e.g. memory modules; Mounting or fixing of storage elements on such supports
• CPC Class Codes: G11C 7/1045 Read-write mode select circuits
• CPC Class Codes: G11C 7/20 Memory cell initialisation circuits, e.g. when powering up or down, memory clear, latent image memory

Abstract

A memory module includes at least one memory chip arranged on the memory module. Information about the memory module and/or the at least one memory chip arranged on the memory module can be stored directly on the memory chip, making use of a suited element, fuses or flip-flops, for example. A memory chip contains such an element for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing element can be read out by means of an external processor.

Claims

1. A memory module comprising:

at least one memory chip arranged on the memory module; and

information containing means containing information relating to the memory module and/or the at least one memory chip arranged on the memory module,

wherein the information containing means is arranged on the memory chip.

2. The memory module according to claim 1, comprising a plurality of memory chips, the information containing means being arranged on the memory chips in a distributed way.

3. The memory module according to claim 1, wherein the information contained in the information containing means relates to operational parameters of the memory module or the memory chip and/or to manufacturer-specific data of the memory module and/or the memory chip.

4. The memory module according to claim 1, wherein the information containing means comprises fuses for permanently programming information.

5. The memory module according to claim 1, wherein the information containing means comprises flip-flops.

6. A memory module, comprising information containing means for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing means can be read out by means of an external processor.

7. The memory chip according to claim 6, wherein the information relates to operational parameters of the memory chip and/or the memory module and/or manufacturer-specific data of the memory chip and/or the memory module.

8. The memory chip according to claim 6, wherein the information containing means comprises fuses for permanently programming information.

9. The memory chip according to claim 6, wherein the information containing means comprises flip-flops.