Method of incorporating deep trench into shallow trench isolation process without added masks
First Claim
1. A method of forming a deep trench device and a shallow trench isolation, said method comprising:
- providing a semiconductor substrate having a first opening thereon;
depositing a first dielectric layer on said semiconductor substrate and into said first opening;
forming a mask layer on said first dielectric layer, said mask layer transferred a pattern consisting of database of reverse shallow trench isolation and database of said deep trench device;
removing partial said first dielectric layer and partial said semiconductor substrate to form a second opening below said first opening;
forming said deep trench device in said second opening; and
forming said shallow trench isolation in said first opening.
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Accused Products
Abstract
The present invention provides a method of forming a deep trench device and a shallow trench isolation comprising providing a semiconductor substrate having a first opening thereon. A dielectric layer is deposited on the semiconductor substrate and into the first opening. A mask layer is formed on the first dielectric layer. The mask layer is transferred a pattern consisting of database of reverse shallow trench isolation and database of the deep trench. The partial first dielectric layer and semiconductor substrate are removed to form a second opening below the first opening. The deep trench device is formed in the second opening and the shallow trench isolation in the first opening.
4 Citations
13 Claims
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1. A method of forming a deep trench device and a shallow trench isolation, said method comprising:
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providing a semiconductor substrate having a first opening thereon;
depositing a first dielectric layer on said semiconductor substrate and into said first opening;
forming a mask layer on said first dielectric layer, said mask layer transferred a pattern consisting of database of reverse shallow trench isolation and database of said deep trench device;
removing partial said first dielectric layer and partial said semiconductor substrate to form a second opening below said first opening;
forming said deep trench device in said second opening; and
forming said shallow trench isolation in said first opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a deep trench device and a plurality of shallow trench isolation devices, said method comprising:
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providing a semiconductor substrate having a plurality of first openings thereon;
depositing a dielectric layer on said semiconductor substrate and into said first openings;
forming a mask layer on said dielectric layer, said mask layer transferred a pattern consisting of database of reverse shallow trench isolation and database of said deep trench device;
removing partial said dielectric layer that is beside said first openings and partial in one of said first openings, and removing partial said semiconductor substrate in said one of said first openings to form a second opening below said one of said first openings;
forming said deep trench device in said second opening; and
forming said shallow trench isolation devices in said first openings. - View Dependent Claims (10, 11, 12, 13)
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Specification