Semiconductor device and method of manufacturing the same
First Claim
1. A semiconductor device wherein a bonding member serves as a supporter and an element is formed on an insulating film that is in contact with the bonding member.
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Accused Products
Abstract
A semiconductor device having a semiconductor element (a thin film transistor, a thin film diode, a photoelectric conversion element of silicon PIN junction, or a silicon resistor element) which is light-weight, flexible (bendable), and thin as a whole is provided as well as a method of manufacturing the semiconductor device. In the present invention, the element is not formed on a plastic film. Instead, a flat board such as a substrate is used as a form, the space between the substrate (third substrate (17)) and a layer including the element (peeled layer (13)) is filled with coagulant (typically an adhesive) that serves as a second bonding member (16), and the substrate used as a form (third substrate (17)) is peeled off after the adhesive is coagulated to hold the layer including the element (peeled layer (13)) by the coagulated adhesive (second bonding member (16)) alone. In this way, the present invention achieves thinning of the film and reduction in weight.
390 Citations
30 Claims
- 1. A semiconductor device wherein a bonding member serves as a supporter and an element is formed on an insulating film that is in contact with the bonding member.
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6. A method of manufacturing a semiconductor device, comprising:
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forming on a first substrate a peeled layer that includes a semiconductor element;
bonding a second substrate to the peeled layer using a first bonding member to sandwich the peeled layer between the first substrate and the second substrate;
separating the first substrate from the peeled layer;
bonding a third substrate to the peeled layer using a second bonding member to sandwich the peeled layer between the second substrate and the third substrate; and
separating the second substrate from the peeled layer and separating the third substrate from the second bonding member to form the peeled layer that uses the second bonding member as a supporter. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A method of manufacturing a semiconductor device, comprising:
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forming on a first substrate a peeled layer that includes a semiconductor element;
bonding a second substrate to the peeled layer using a first bonding member to sandwich the peeled layer between the first substrate and the second substrate;
separating the first substrate from the peeled layer;
bonding a third substrate to the peeled layer using a second bonding member to sandwich the peeled layer between the second substrate and the third substrate; and
separating the third substrate from the peeled layer and separating the second substrate from the peeled layer to form the peeled layer that uses the first and second bonding members as a supporter. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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20. A method of manufacturing a semiconductor device, comprising:
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forming on a first substrate a peeled layer that includes a semiconductor element;
bonding a second substrate to the peeled layer using a first bonding member to sandwich the peeled layer between the first substrate and the second substrate;
separating the first substrate from the peeled layer;
bonding a third substrate to the peeled layer using a second bonding member to sandwich the peeled layer between the second substrate and the third substrate; and
separating the second substrate from the peeled layer to form the peeled layer that uses the second bonding member and the third substrate as a supporter. - View Dependent Claims (21, 22, 23)
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- 24. A semiconductor device wherein a plastic substrate and a bonding member serves as a supporter and an element is formed on an insulating film that is in contact with the bonding member.
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29. A method of manufacturing a semiconductor device, comprising:
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forming on a first substrate a peeled layer that includes a semiconductor element;
bonding a second substrate to the peeled layer using a first bonding member to sandwich the peeled layer between the first substrate and the second substrate;
separating the first substrate from the peeled layer;
bonding a third substrate in which a protective film is formed to the peeled layer using a second bonding member to sandwich the peeled layer between the second substrate and the third substrate; and
separating the second substrate from the peeled layer and separating the third substrate from the second bonding member to form the peeled layer that uses the second bonding member and the protective film as a supporter. - View Dependent Claims (30)
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Specification