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Semiconductor device and method of manufacturing the same

  • US 20030082889A1
  • Filed: 10/30/2002
  • Published: 05/01/2003
  • Est. Priority Date: 10/30/2001
  • Status: Active Grant
First Claim
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1. A semiconductor device wherein a bonding member serves as a supporter and an element is formed on an insulating film that is in contact with the bonding member.

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