Method of fabricating an integrated circuit that seals a MEMS device within a cavity

• US 20030087469A1
• Filed: 11/02/2001
• Published: 05/08/2003
• Est. Priority Date: 11/02/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ma, Oing
• Granted Patent: US 6,808,955 B2
• Time in Patent Office: Days
• US Class Current: 438/51
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05023 the whole internal layer protruding from the surface
• CPC Class Codes: H01L 2224/0508 being stacked
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.

Claims

1. A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device, comprising:

forming a MEMS device on a substrate;

forming an integrated circuit; and

coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device.

2. The method of claim 1, wherein coupling the substrate to the integrated circuit includes coupling the substrate to a chip.

3. The method of claim 1, wherein forming a MEMS device on a substrate includes forming a ring layer on the substrate that surrounds the MEMS device.

4. The method of claim 3, wherein coupling the substrate to the integrated circuit includes bonding the ring layer to the integrated circuit.

5. The method of claim 3, wherein the ring layer is electrically conductive.

6. The method of claim 5, wherein forming a MEMS device on a substrate includes depositing a wettable layer onto the ring layer.

7. The method of claim 3, wherein forming an integrated circuit includes forming a ring layer on a surface of the integrated circuit.

8. The method of claim 7, wherein coupling the substrate to the integrated circuit includes bonding the ring layer on the substrate to the ring layer on the integrated circuit.

9. The method of claim 8, wherein forming an integrated circuit includes forming solder bumps within the ring layer on the substrate and forming a MEMS device on a substrate includes forming pads on the substrate, and coupling the substrate to the integrated circuit includes bonding the pads on the substrate to the solder bumps on the integrated circuit.

10. The method of claim 1, wherein forming an integrated circuit includes forming a ring layer on the substrate.

11. The method of claim 10, wherein coupling the substrate to the integrated circuit includes bonding the ring layer to the substrate.

12. The method of claim 1, wherein coupling the substrate to the integrated circuit includes coupling the substrate to the integrated circuit in a controlled environment.

13. The method according to claim 12, wherein coupling the substrate to the integrated circuit in a controlled environment includes coupling the substrate to the integrated circuit in a hermetic environment.

14. The method according to claim 12, wherein coupling the substrate to the integrated circuit in a controlled environment includes coupling the substrate to the integrated circuit in a vacuum.

15. A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device, comprising:

forming a MEMS device on a substrate;

forming a ring layer on the substrate that surrounds the MEMS device;

forming an integrated circuit;

forming a ring layer on a surface of the integrated circuit; and

coupling the substrate to the integrated circuit by bonding the ring layer on the substrate to the ring layer on the integrated circuit to form a sealed cavity that includes the MEMS device.

16. The method of claim 15, wherein coupling the substrate to the integrated circuit includes coupling the substrate to a chip.

17. The method of claim 15, wherein coupling the substrate to the integrated circuit includes coupling the substrate to the integrated circuit in a controlled environment.

18. The method of claim 15, wherein the ring layers on the substrate and the integrated circuit are electrically conductive.

19. A method of forming a microelectromechanical (MEMS) device, comprising:

forming a MEMS device on a substrate; and

coupling the substrate to a chip to form a sealed cavity that includes the MEMS device.

20. The method of claim 19, wherein forming a MEMS device on a substrate includes forming a ring layer on the substrate that surrounds the MEMS device.

21. The method of claim 20, wherein coupling the substrate to the chip includes bonding the ring layer on the substrate to the chip.

22. The method of claim 19, wherein coupling the substrate to the chip includes coupling the substrate to the chip in a controlled environment such that sealed cavity becomes a controlled environment.

23. An integrated circuit comprising:

a body including a MEMS device mounted on a surface of the body, the body including a ring layer on the surface of the body that surrounds the MEMS device; and

a substrate bonded to the ring layer on the integrated circuit to seal the MEMS device within a cavity defined by the body, the ring layer and the substrate.

24. The integrated circuit of claim 23, wherein the substrate is a chip.

25. The integrated circuit of claim 23, further comprising a wettable layer deposited onto the ring layer.

26. The integrated circuit of claim 23, wherein the substrate includes a ring layer on a surface of the substrate that is bonded to the ring layer on the body.

27. The integrated circuit of claim 26, wherein the substrate includes solder bumps within the ring layer on the substrate, and the body includes pads within the ring layer on the body such that the pads are bonded to the solder bumps.

28. The integrated circuit of claim 26, wherein the ring layers on the substrate and the integrated circuit are electrically conductive.