Electronic module and method for its production

• US 20030087470A1
• Filed: 10/21/2002
• Published: 05/08/2003
• Est. Priority Date: 10/23/2001
• Status: Active Grant

• Current Assignee: TRW Automotive USLLC (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Original Assignee: TRW Automotive Electronics & Components GmbH & Co. KG
• Inventors: Linke, Ralph
• Granted Patent: US 6,919,221 B2
• Time in Patent Office: Days
• US Class Current: 438/64
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 3/182 characterised by the patterning method

Abstract

The electronic module whose electronic components are connected by conductor tracks has a housing with a base body housing made of electrically non-conductive plastic. The base body housing is provided with recessed conduits on the inside surface of its housing wall, and a galvanizable plastic is introduced into these conduits. The conductor tracks are formed by a metallization applied onto the galvanizable plastic and they can run three-dimensionally along different wall sections of the base body housing.

Claims

1. A method of producing an electronic module comprising electronic components and a plastic housing, wherein

a base body housing is made of an electrically non-conductive plastic with recessed conduits;

a galvanizable plastic material is introduced into the conduits;

exposed surface areas of the galvanizable plastic material are metallized thereby forming conductor tracks,

the electronic components are placed onto said conductor tracks and both electrically and mechanically connected to the conductor tracks.

2. The method according to claim 1, wherein the base body housing is made by means of injection molding.

3. The method according to claim 2, wherein the conduits are formed by means of an interchangeable mold core.

4. The method according to claim 3, wherein the galvanizable plastic material is introduced into the conduits by means of injection molding.

5. The method according to claim 1, wherein electronics housings with different conductor tracks and/or a different arrangement of the electronic components are produced with one and the same injection mold by means of interchangeable mold cores.

6. The method according to claim 1, wherein contact pins that project into the inside of the base body housing are electrically contacted with surrounding conductor tracks in the step of metallizing exposed surface areas of the galvanizable plastic material.

7. An electronic module comprising electronic components and a plastic housing, wherein the housing has a base body housing made of electrically non-conductive plastic, internal housing walls of said base body housing having recessed conduits therein in which a galvanizable plastic material has been introduced, and conductor tracks are formed by a metallization applied onto exposed surface areas of the galvanizable plastic material, and said electronic components being connected to said conductor tracks.

8. The electronic module according to claim 7, wherein the electronic components are placed onto the conductor tracks and are connected to them by means of soldering.

9. The electronic module according to claim 7, wherein the conductor tracks are shaped three-dimensionally into different wall sections of the base body housing that are connected to each other at an angle.

10. The electronic module according to claim 7, wherein the electronic components comprise an acceleration sensor.