Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system

• US 20030087476A1
• Filed: 09/06/2002
• Published: 05/08/2003
• Est. Priority Date: 09/06/2001
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Oohata, Toyoharu, Iwafuchi, Toshiaki, Ohba, Hisashi
• Granted Patent: US 6,972,204 B2
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: G09F 9/35 being liquid crystals G09F9/302 takes precedence; liquid crystal materials C09K19/00; liquid crystal panels comprising a number of electrodes in a single cell per se G02F1/13
• CPC Class Codes: H01J 2217/49 Display panels, e.g. not making use of alternating current H01J2211/10 takes precedence
• CPC Class Codes: H01J 9/02 Manufacture of electrodes or electrode systems
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/82005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 24/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/0095 : Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Abstract

A first adhesive layer is provided on a base substrate, and multiple devices are arranged on the first adhesive layer. The first adhesive layer is irradiated with laser light from the back side of the base substrate, only at positions corresponding to the devices to be transferred, by use of a mask, whereby the adhesive force of the first adhesive layer is lowered only at these positions, and only these devices are made releasable from the base substrate. A transfer substrate provided with a second adhesive layer and the base substrate are so disposed that the devices and the second adhesive layer are opposite to each other and pressed against each other. When the transfer substrate is stripped from the base substrate, only the devices to be transferred are selectively transferred onto the transfer substrate.

Claims

1. A method of transferring at least one device, comprising the steps of:

determining at least one device to be transferred from a number of devices arranged and fixed on a first substrate;

making the at least one device releasable from the first substrate; and

transferring the releasable at least one device from the first substrate onto a second substrate including an adhesive layer.

2. A method of transferring at least one device as set forth in claim 1, wherein the devices are arranged and fixed on an adhesive layer made of a thermoplastic material on the first substrate, and the transferring method further includes the step of:

heating the adhesive layer on the first substrate at at least one position respectively corresponding to the at least one device to be transferred on the first substrate to make the at least one device releasable from the first substrate.

3. A method of transferring at least one device as set forth in claim 2, wherein the step of heating the adhesive layer on the first substrate includes irradiating the adhesive layer with a laser light.

4. A method of transferring at least one device as set forth in claim 3, wherein the step of irradiating the adhesive layer on the first substrate includes selectively irradiating the adhesive layer with the laser light at at least one position respectively corresponding to the at least one device to be transferred on the first substrate.

5. A method of transferring at least one device as set forth in claim 1, further including the steps of:

heating the at least one device to be transferred with irradiation by a laser light; and

heating an adhesive layer on the first substrate at the position or positions corresponding to the positions of the device or devices to be transferred on the first substrate.

6. A method of transferring at least one device as set forth in claim 1, wherein the adhesive layer includes a thermosetting material and the adhesive layer is melted and cured by heating and cooling the adhesive layer to fix the at least one device on the second substrate.

7. A method of transferring at least one device as set forth in claim 6, wherein the thermosetting material is a thermosetting resin.

8. A method of transferring at least one device as set forth in claim 1, wherein the adhesive layer includes at least one recessed portion having a shape corresponding to a shape of the at least one device, and wherein the at least one recessed portion is located on a surface of the second substrate on a side where the at least one device is to be transferred.

9. A method of transferring at least one device as set forth in claim 1, which further includes the step of embedding the device or devices in an insulating material.

10. A method of transferring at least one device as set forth in claim 1, wherein the step of making the at least one device releasable from the first substrate includes using laser ablation.

11. A method of transferring a plurality of devices arranged on a first substrate onto a second substrate, comprising the steps of:

transferring the devices to a first temporary holding member so the devices are spaced wider apart compared with a spacing of the devices on the first substrate;

fixing the devices to the first temporary holding member with a resin;

dicing the resin to separate the fixed devices; and

transferring the devices from the first temporary holding member onto the second substrate while spacing the devices further apart from each other, wherein the step of transferring the devices from the first temporary holding member comprises the steps of;

making the devices to be transferred releasable from a second temporary holding member; and

transferring the releasable devices from the second temporary holding member onto the second substrate including an adhesive layer.

12. A method of transferring the devices as set forth in claim 11, wherein at least one of the devices is a semiconductor device using a nitride semiconductor.

13. A method of transferring one or more devices as set forth in claim 11, wherein at least one of the devices is a device selected from the group consisting of:

a light-emitting device, a liquid crystal control device, a photo-electric conversion device, a piezoelectric device, a thin film transistor device, a thin film diode device, a resistance device, a switching device, a micro magnetic device, and a micro optical device.

14. A method of manufacturing an image display system having a plurality of light-emitting devices arranged in a matrix form, the method comprising the steps of:

transferring the light-emitting devices to a first temporary holding member so that the devices are spaced wider apart from each other compared with a spacing of the devices on a first substrate;

fixing the light-emitting devices on the first temporary holding member using a resin;

dicing the resin on a light-emitting device basis to separate the resin-fixed light-emitting devices from the first temporary holding member; and

transferring the light-emitting devices from the first temporary holding member onto a second substrate while spacing the light-emitting devices further apart from each other, wherein the step of transferring the light-emiting devices from the first temporary holding member comprises the steps of;

making the light-emitting devices to be transferred releasable from a second temporary holding member; and

transferring the releasable light-emitting devices from the second temporary holding member onto the second substrate including an adhesive layer.