Cooling apparatus having low profile extrusion and method of manufacture therefor

• US 20030089486A1
• Filed: 12/23/2002
• Published: 05/15/2003
• Est. Priority Date: 06/08/1998
• Status: Active Grant

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Parish, Overton L., DeVilbiss, Roger S.
• Granted Patent: US 7,322,400 B2
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: F28D 1/0246 heat-exchange elements having several adjacent conduits forming a whole, e.g. blocks
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 2021/0031 Radiators for recooling a coolant of cooling systems
• CPC Class Codes: F28F 1/022 with multiple channels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49353 Heat pipe device making
• CPC Class Codes: Y10T 29/49377 Tube with heat transfer means
• CPC Class Codes: Y10T 29/49378 Finned tube
• CPC Class Codes: Y10T 29/49385 Made from unitary workpiece, i.e., no assembly
• CPC Class Codes: Y10T 29/49396 Condenser, evaporator or vaporizer making

Abstract

A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.

Claims

1. A cooling apparatus for removing heat from at least one heat generating component, said cooling apparatus comprising:

a low profile member defining an interior space having an evaporator section and a condenser section, said evaporator section having a first exterior surface adapted for receiving heat from the at least one heat generating component; and

wherein said interior space is adapted to receive a heat transfer fluid.

2. The cooling apparatus of claim 1, wherein said interior space is divided by at least one longitudinal member.

3. The cooling apparatus of claim 2, wherein said at least one longitudinal member is offset from vertical.

4. The cooling apparatus of claim 3, wherein said low profile member defines a first end and a second end, wherein said interior space of said low profile member is sealed at each of said first end and said second end.

5. The cooling apparatus of claim 4, wherein said condenser section is elevated with respect to said evaporator section.

6. The cooling apparatus of claim 5, wherein said interior space is comprised of a plurality of microtubes.

7. The cooling apparatus according to claim 6 further comprising:

at least one capillary groove on an interior surface of each of said plurality of micro tubes.

8. The cooling apparatus of claim 7, wherein each of said plurality of micro tubes are individually sealed.

9. The cooling apparatus of claim 8, wherein each of said plurality of micro tubes are connected in fluid communication.

10. The cooling apparatus of claim 9, further comprising a wick within each of said micro tubes.

11. The cooling apparatus of claim 10, wherein said wick is a metal screen.

12. The cooling apparatus of claim 11, wherein a plurality of said low profile extrusions are mounted as fins on a heat sink.

13. The cooling apparatus of claim 12, further comprising:

at least one fin on an interior surface of said interior space.

14. The cooling apparatus of claim 13, further comprising at least one wick within said interior space.

15. The cooling apparatus of claim 14, wherein said wick is a metal screen.

16. The cooling apparatus of claim 1, further comprising at least one thermoelectric cooling unit disposed between said at least one heat generating component and said first exterior extrusion surface.

17. A cooling apparatus and heat generating component combination comprising:

at least one heat generating component;

a low profile member defining an interior space having an evaporator section and a condenser section, said evaporator section having a first exterior surface adapted for receiving heat from said at least one heat generating component; and

a heat transfer fluid located within said interior space for absorbing heat from said at least one heat generating component.

18. The cooling apparatus of claim 17, wherein said interior space is divided by at least one longitudinal member.

19. The cooling apparatus of claim 18, wherein said at least one longitudinal member is offset from vertical.

20. The combination of claim 19, wherein said low profile member defines a first end and a second end, wherein said interior space of said low profile member is sealed at each of said first end and said second end.

21. The cooling apparatus of claim 20, wherein said condenser section is elevated with respect to said evaporator section.

22. The cooling apparatus of claim 21, wherein said interior space is comprised of a plurality of micro tubes.

23. The cooling apparatus according to claim 22 further comprising:

at least one fin on an interior surface of each of said plurality of micro tubes.

24. The cooling apparatus of claim 23, wherein each of said plurality of micro tubes are individually sealed.

25. The cooling apparatus of claim 24, wherein each of said plurality of micro tubes are connected in fluid communication.

26. The cooling apparatus of claim 25, further comprising a wick within each of said micro tubes.

27. The cooling apparatus of claim 26, wherein said wick is a metal screen.

28. The cooling apparatus of claim 27, further comprising:

at least one fin on an interior surface of said interior space.

29. The cooling apparatus of claim 28, wherein a plurality of said low profile extrusions are mounted as fins on a heat sink.

30. The cooling apparatus of claim 29, further comprising at least one wick within said interior space.

31. The cooling apparatus of claim 30, wherein said wick is a metal screen.