Semiconductor manufacturing system with exhaust pipe, deposit elimination method for use with semiconductor manufacturing system, and method of manufacturing semiconductor device
First Claim
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1. A semiconductor manufacturing system for forming a thin film on a substrate, comprising:
- a supply section for supplying a reactive gas to a reaction chamber;
a first exhaust section for exhausting the reactive gas from the reaction chamber;
an air intake section for drawing outside air into the reaction chamber; and
a second exhaust section which has exhaust power higher than that of said first exhaust section, said second exhaust section exhausting a by-product deposited on an interior wall of the reaction chamber from the reaction chamber together with the outside air.
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Abstract
A reactive gas is supplied to a reaction chamber by way of a reactive gas supply pipe. The reactive gas is exhausted from the reaction chamber by way of a main exhaust pipe. Outside air is drawn into the reaction chamber by way of an air intake pipe by means of opening an air intake valve. Further, a main exhaust valve is closed, and a dust collection exhaust valve is opened. As a result, a by-product deposited on an interior wall of the reaction chamber and in the main exhaust pipe is exhausted by way of a dust collection exhaust pipe having exhaust power higher than that of the main exhaust pipe.
149 Citations
16 Claims
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1. A semiconductor manufacturing system for forming a thin film on a substrate, comprising:
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a supply section for supplying a reactive gas to a reaction chamber;
a first exhaust section for exhausting the reactive gas from the reaction chamber;
an air intake section for drawing outside air into the reaction chamber; and
a second exhaust section which has exhaust power higher than that of said first exhaust section, said second exhaust section exhausting a by-product deposited on an interior wall of the reaction chamber from the reaction chamber together with the outside air. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 16)
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10. A deposit elimination method for use with a semiconductor manufacturing system, comprising:
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a first exhaust step of exhausting a reactive gas from a reaction chamber, after formation of a thin film on a substrate in the reaction chamber of the semiconductor manufacturing system; and
a second exhaust step of drawing outside air into the reaction chamber after said first exhaust step, and exhausting the outside air from the reaction chamber at the same time, wherein said second exhaust step is performed at a higher exhaust rate than said first exhaust step. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification