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Atmospheric pressure wafer processing reactor having an internal pressure control system and method

  • US 20030094136A1
  • Filed: 08/23/2002
  • Published: 05/22/2003
  • Est. Priority Date: 08/24/2001
  • Status: Active Grant
First Claim
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1. A wafer processing system for delivering at least one gas to a wafer surface and removing one or more exhaust gases from said wafer surface, comprising:

  • an atmospheric pressure muffle;

    one or more exhaust passages for exhausting gases from said muffle; and

    an exhaust control feedback system coupled to said muffle and said one or more exhaust passages, said feedback system having one or more sensors to measure one or more pressure differentials between at least one selected point within said muffle or said exhaust passages and the chase ambient pressure external to said wafer processing system and to adjust one or more control units to maintain one or more desired setpoint values for said pressure differentials within said wafer processing system.

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