Pressure-welded structure of flexible circuit boards

• US 20030094305A1
• Filed: 10/25/2002
• Published: 05/22/2003
• Est. Priority Date: 10/29/2001
• Status: Active Grant

• Current Assignee: Trivale Technologies, LLC (Vector Capital Corporation)
• Original Assignee: Advanced Display Technologies
• Inventors: Ueda, Hiroshi
• Granted Patent: US 6,952,250 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films. A resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm. It is possible to improve not only the yield in module assembly but also the quality and reliability of the product.

Claims

1. A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on an end surface of a TFT glass substrate via anisotropic conductive films, wherein a resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from an end portion of a resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm.

2. The pressure-welded structure of flexible circuit boards of claim 1, wherein the resin applied on the surface opposite to the terminal surface of the flexible circuit boards is one selected from the group consisting of an epoxy resin, a polyimide resin, a urethane resin, and a silicone resin.

3. The pressure-welded structure of flexible circuit boards of claim 1, wherein the resin applied on the surface opposite to the terminal surface of the flexible circuit boards has a higher coefficient of elasticity than the resin applied on the terminal surface.

4. A pressure-welded structure of flexible circuit boards in a liquid crystal display device having a group of lead terminals of flexible circuit boards connected with a plurality of terminals aligned on a surfaces of a printed circuit board via anisotropic conductive films, wherein a resin is applied on a surface opposite to the terminal surface of the flexible circuit boards, and an end portion of the resin is 0.1 to 10 mm away from the end portion of the resin applied on the terminal surface of the flexible circuit boards, thereby both resins applied on the terminal surface and on the other surface overlap each other by 0.1 to 10 mm.

5. The pressure-welded structure of flexible circuit boards of claim 4, wherein the resin applied on the surface opposite to the terminal surface of the flexible circuit boards is one selected from the group consisting of an epoxy resin, a polyimide resin, a urethane resin, and a silicone resin.

6. The pressure-welded structure of flexible circuit boards of claim 4, wherein the resin applied on the surface opposite to the terminal surface of the flexible circuit boards has a higher coefficient of elasticity than the resin applied on the terminal surface.