Optical device package for flip-chip mounting
First Claim
Patent Images
1. An optical device package which comprises:
- a) a substrate having an upper surface;
b) an optical fiber mounted to the substrate;
c) a frame mounted to the upper surface of the substrate, the frame including conductive pathways extending between a top surface of the frame and a bottom surface of the frame; and
, d) contact means disposed on the top surface of the frame for flip mounting the optical device package to a platform.
6 Assignments
0 Petitions
Accused Products
Abstract
An optical device package includes a substrate; an optical fiber, a frame, and optionally a lid and an optical semiconductor component. The upper surface of the frame includes conductive vias extending vertically to solder balls on its upper surface. Conductive traces along the surface of the substrate provide electrical communication between the optical semiconductor component and the frame. The optical device package is adapted for flip-chip type mounting to a circuit board or other mounting surface.
69 Citations
22 Claims
-
1. An optical device package which comprises:
-
a) a substrate having an upper surface;
b) an optical fiber mounted to the substrate;
c) a frame mounted to the upper surface of the substrate, the frame including conductive pathways extending between a top surface of the frame and a bottom surface of the frame; and
,d) contact means disposed on the top surface of the frame for flip mounting the optical device package to a platform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
-
-
19. A method for making an optical device package comprising the steps of:
-
a) mounting an optical fiber to a substrate having an upper surface;
b) forming a conductive trace on the upper surface of the substrate;
c) mounting a frame to the substrate, the frame having a frame upper surface with at least one solder pad thereon, and a conductive via extending from the solder pad to the conductive trace; and
,d) mounting an optical semiconductor component on the substrate in contact with the conductive trace and in alignment with the optical fiber. - View Dependent Claims (20, 21)
-
-
22. A method for assembling an electronic circuit comprising:
-
a) providing an optical device package which includes i) a substrate having an upper surface;
ii) an optical semiconductor component mounted to the substrate;
iii) an optical fiber mounted to the substrate in alignment with the optical semiconductor component;
iv) a frame mounted to the upper surface of the substrate, the frame having an upper surface with a patterned array of solder balls thereon, and at least one conductive pathway extending from each solder ball to the upper major surface of the substrate; and
v) at least one conductive trace electrically connecting the at least one conductive pathway and the optical semiconductor component;
b) providing a circuit board having a patterned 20 array of bonding pads which is a mirror image of the patterned array of solder balls on the frame;
c) inverting and positioning the optical device package such that individual solder balls of the patterned array solder balls of the optical device package are in contact with corresponding individual bonding pads of the patterned array of bonding pads on the circuit board; and
d) fusing the solder balls to the corresponding bonding pads.
-
Specification