Retention mechanism for an electrical assembly
First Claim
1. A retention mechanism for an electronic assembly which includes a substrate and a heat sink, comprising:
- a plurality of walls that create a heat sink slot that can receive the heat sink and a substrate slot that allows the substrate to extend through said substrate slot.
1 Assignment
0 Petitions
Accused Products
Abstract
A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
78 Citations
20 Claims
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1. A retention mechanism for an electronic assembly which includes a substrate and a heat sink, comprising:
a plurality of walls that create a heat sink slot that can receive the heat sink and a substrate slot that allows the substrate to extend through said substrate slot. - View Dependent Claims (2, 3, 4, 5, 6, 17)
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7. An electrical assembly, comprising:
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a printed circuit board;
a retention mechanism mounted to said printed circuit board, said retention mechanism including a plurality of walls that create a heat sink slot and a substrate slot; and
,an electronic assembly that is coupled to said printed circuit board, said electronic assembly includes a substrate that is inserted into said substrate slot and a heat sink that is inserted into said heat sink slot. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method for installing an electronic assembly which includes a substrate and a heat sink, comprising:
a) inserting the substrate into a substrate slot of a retention mechanism that is mounted to a printed circuit board and the heat sink into a heat sink slot of said retention mechanism. - View Dependent Claims (15)
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16. A retention mechanism for an electronic assembly which includes a substrate and a heat sink, wherein the electronic assembly is coupled to a printed circuit board and secured by a nut that is attached to a stud, comprising:
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a plurality of walls that create a heat sink slot that can receive the heat sink; and
,a nut retainer that can retain the nut.
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18. An electrical assembly, comprising:
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a printed circuit board;
a stud that extends from said printed circuit board;
a retention mechanism mounted to said printed circuit board, said retention mechanism including a plurality of walls that create a heat sink slot, said retention mechanism further having a nut retainer; and
,a nut that is captured by said nut retainer and is attached to said stud. - View Dependent Claims (19)
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20. A method for installing an electronic assembly, comprising:
a) inserting a nut into a nut retainer of a retainer mechanism that retains the electronic assembly.
Specification