Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices
First Claim
1. A method of performing a semiconductor manufacturing process, the method comprising:
- i) transferring a first group of wafers into a first reactor;
ii) performing a first process on the first group of wafers within the first reactor;
iii) after the first process has been completed in the first reactor, transferring the first group of wafers into a first one of a plurality of second reactors while the first group of wafers is isolated from air outside the first and second reactors;
iv) performing a second process, requiring a process time longer than that required by the first process, on the first group of wafers within the first one of the second reactors, and at the same time transferring a second group of wafers into the first reactor;
v) performing the first process on the second group of wafers within the first reactor;
vi) transferring the second group of wafers, that have undergone the first process, into a second one of the second reactors that is not occupied by wafers while the second group of wafers is isolated from air outside the first and second reactors;
vii) performing the second process on the second group of wafers within the second one of the second reactors while the first group of wafers are undergoing the second process in the first one of the second reactors; and
viii) unloading the groups of wafers, that have undergone the second process, from the second reactors.
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Abstract
A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.
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Citations
32 Claims
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1. A method of performing a semiconductor manufacturing process, the method comprising:
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i) transferring a first group of wafers into a first reactor;
ii) performing a first process on the first group of wafers within the first reactor;
iii) after the first process has been completed in the first reactor, transferring the first group of wafers into a first one of a plurality of second reactors while the first group of wafers is isolated from air outside the first and second reactors;
iv) performing a second process, requiring a process time longer than that required by the first process, on the first group of wafers within the first one of the second reactors, and at the same time transferring a second group of wafers into the first reactor;
v) performing the first process on the second group of wafers within the first reactor;
vi) transferring the second group of wafers, that have undergone the first process, into a second one of the second reactors that is not occupied by wafers while the second group of wafers is isolated from air outside the first and second reactors;
vii) performing the second process on the second group of wafers within the second one of the second reactors while the first group of wafers are undergoing the second process in the first one of the second reactors; and
viii) unloading the groups of wafers, that have undergone the second process, from the second reactors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus for performing a semiconductor manufacturing process, the apparatus comprising:
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a first batch reactor in which a first process is performed, the first batch reactor having an inlet;
at least two second batch reactors in which the same second process is performed, the second process requiring more time to complete than the first process, and each of the second batch reactors having a respective inlet;
a loadlock chamber that confronts the inlets of the first and second reactors so as to provide a path along which wafers can be transferred through the loadlock chamber between the first and either of the second reactors, the loadlock chamber being sealed from outside air; and
a transfer module disposed in the loadlock chamber, the transfer module having a working envelope encompassing the inlets of said first and second reactors and operable to transfer respective groups of wafers to and from the reactors. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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Specification