Connecting structure of printed circuit boards

• US 20030098339A1
• Filed: 01/13/2003
• Published: 05/29/2003
• Est. Priority Date: 08/04/2000
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Hajime Nakagawa, Kazuyuki Deguchi, Makoto Totani, Takehito Teramae, Tomohiro Yokochi, Toshihiro Miyake, Yoshitaro Yazaki
• Inventors: Deguchi, Kazuyuki, Teramae, Takehito, Miyake, Toshihiro, Nakagawa, Hajime, Totani, Makoto, Yokochi, Tomohiro, Yazaki, Yoshitaro
• Granted Patent: US 6,966,482 B2
• Time in Patent Office: Days
• US Class Current: 228/175
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/091 Locally and permanently deformed areas including dielectric material
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10772 Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/065 Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: H05K 3/363 by soldering

Abstract

Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Claims

1. A connecting method of printed circuit boards, comprising:

forming a conductive pattern having a first plurality of lands, on a first printed circuit board made of a thermoplastic resin;

forming a conductive pattern having a second plurality of lands, on a second printed circuit board;

forming a solder resist portion on the second printed circuit board, between neighboring two lands of the second plurality of lands;

supplying solder to at least one side of the first plurality of lands and the second plurality of lands;

overlapping the first plurality of lands with the second plurality of lands to interpose the solder between the first plurality of lands and the second plurality of lands; and

pressurizing and heating a connecting portion of the first printed circuit board and the second printed circuit board, at a predetermined temperature to electrically connect the first plurality of lands and the second plurality of lands through the solder, and to adhere the first printed circuit board to a surface of the second printed circuit board by the thermoplastic resin of the first printed circuit board that is softened and deformed at the predetermined temperature, the predetermined temperature being equal to or higher than a glass transition temperature of the thermoplastic resin and being equal to or higher than a fusing temperature of the solder, wherein;

the solder resist portion is terminated to have an end portion that is interposed between the first printed circuit board and the second printed circuit board at the connecting portion.

2. The connecting method of claim 1, wherein the connecting portion is pressurized by a pressurizing member that contacts the first printed circuit board and applies larger pressure to a middle portion of the connecting portion than that to an edge portion of the connecting portion.

3. The connecting method of claim 2, wherein the pressurizing member has an edge portion that is tapered, recessed, or stepped.

4. The connecting method of claim 1, wherein the solder resist portion is spaced from the neighboring two lands of the second plurality of lands, on the second printed circuit board.

5. The connecting method of claim 4, wherein a gap between the solder resist portion and each of the neighboring two lands is 30 μ

m at least.

6. A connecting method of printed circuit boards, comprising:

forming a first conductive pattern including a first plurality of lands, on a first printed circuit board that is made of a thermoplastic resin;

forming a second conductive pattern including a second plurality of lands, on a second printed circuit board;

forming a protective film on the second conductive pattern of the second printed circuit board except a connecting portion where the second conductive pattern is to be connected to the first conductive pattern of the first printed circuit board;

applying solder to at least one side of the first plurality of lands and the second plurality of lands;

overlapping the first plurality of lands with the second plurality of lands to interpose the solder between the first plurality of lands and the second plurality of lands, and to form a gap between an edge face of the first printed circuit board and an edge face of the protective film, the gap exposing the second conductive pattern therefrom; and

pressurizing and heating the connecting portion of the first printed circuit board and the second printed circuit board at a predetermined temperature to electrically connect the first plurality of lands and the second plurality of lands through the solder, and to adhere the first printed circuit board to a connecting surface of the second printed circuit board by the thermoplastic resin of the first printed circuit board that is softened and deformed at the predetermined temperature, the predetermined temperature being equal to or higher than a glass transition temperature of the thermoplastic resin and being equal to or higher than a fusing temperature of the solder, wherein;

the gap between the edge face of the first printed circuit board and the edge face of the protective film works as an escape space into which surplus solder can be extruded from the connecting portion when the connecting portion is pressurized.

7. The connecting method of claim 6, further comprising:

forming another protective film made of a thermoplastic resin, to cover the first conductive pattern on the first printed circuit board, before the first printed circuit board is overlapped with the second printed circuit board, wherein;

the another protective film is adhered to the connecting surface of the second printed circuit board.

8. The connecting method of claim 6, further comprising sealing the gap between the edge face of the first printed circuit board and the edge face of the protective film.

9. The connecting method of claim 6, wherein electrical connection between the first plurality of lands and the second plurality of lands is achieved simultaneously with adhesion of the first printed circuit board to the second printed circuit board.

10. A connecting method of printed circuit boards, comprising:

forming a first conductive pattern including a first plurality of lands, on a first printed circuit board that is made of a thermoplastic resin;

forming a second conductive pattern including a second plurality of lands, on a second printed circuit board;

applying solder to at least one side of the first plurality of lands and the second plurality of lands;

overlapping the first plurality of lands with the second plurality of lands; and

pressurizing and heating a connecting portion of the first printed circuit board and the second printed circuit board at a predetermined temperature to electrically connect the first plurality of lands and the second plurality of lands through the solder, and to adhere the first printed circuit board to a connecting surface of the second printed circuit by the thermoplastic resin of the first printed circuit board that is softened and deformed at the predetermined temperature, the predetermined temperature being equal to or higher than a glass transition temperature of the thermoplastic resin and being equal to or higher than a fusing temperature of the solder, wherein;

the connecting portion is pressurized by a pressurizing member that contacts the first printed circuit board and applies larger pressure to a middle portion of the first conductive pattern than that to an end portion of the first conductive pattern.

11. The connecting method of claim 10, wherein:

the end portion of the first conductive pattern is formed on an edge portion of the first printed circuit board; and

the pressurizing member applies the larger pressure to a middle portion of the first printed circuit board than that to the edge portion of the first printed circuit board.

12. The connecting method of claim 10, wherein the pressurizing member has an edge portion that is tapered, recessed, or stepped.

13. The connecting method of claim 10, further comprising:

forming another protective film made of a thermoplastic resin, on the first printed circuit board, before the first printed circuit board is overlapped with the second printed circuit board, wherein;

the another protective film is adhered to the connecting surface of the second printed circuit board.

14. The connecting method of claim 10, wherein electrical connection between the first plurality of lands and the second plurality of lands is achieved simultaneously with adhesion of the first printed circuit board to the second printed circuit board.

15. A connecting structure of printed circuit boards, comprising:

a first printed circuit board made of a thermoplastic resin and having a first conductive pattern with a first plurality of lands thereon;

a second printed circuit board having a second conductive pattern with a second plurality of lands thereon and overlapped with the first printed circuit board at a connecting portion;

a solder interposed between the first plurality of lands and the second plurality of lands and electrically connecting the first plurality of lands and the second plurality of lands; and

a solder resist portion disposed on the second printed circuit board between neighboring two lands of the second plurality of lands, extending to the connecting portion, and being terminated with an end portion that is interposed between the first printed circuit board and the second printed circuit board.

16. The connecting structure of claim 15, wherein the solder resist portion is spaced from the neighboring two lands.

17. The connecting structure of claim 16, wherein a gap between the solder resist portion and each of the neighboring two lands is 30 μ

m at least.

18. The connecting structure of claim 15, wherein a substrate surface of the first printed circuit board adheres to a substrate surface of the second printed circuit board at the connecting portion.