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Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pad, semiconductor device components including same, and methods for fabricating same

  • US 20030098499A1
  • Filed: 12/23/2002
  • Published: 05/29/2003
  • Est. Priority Date: 06/08/2000
  • Status: Abandoned Application
First Claim
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1. A semiconductor device component, comprising:

  • a substrate having contact pads exposed at a surface thereof; and

    at least one collar at least partially surrounding at least one contact pad of said contact pads, said at least one collar protruding from said surface so as to laterally contain material of at least a base portion of a conductive structure securable to said at least one contact pad.

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