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Edge-plated well for circuit board components

  • US 20030100197A1
  • Filed: 08/13/2002
  • Published: 05/29/2003
  • Est. Priority Date: 11/26/2001
  • Status: Active Grant
First Claim
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1. A method of mounting a component to a multi-layer printed circuit board and a pallet, the multi-layer printed circuit board comprising a top circuitry layer, a bottom layer and a ground plane layer disposed between the top circuitry layer and the bottom layer, the method comprising:

  • forming a hole through the top circuitry layer, the ground plane layer and the bottom layer, thereby exposing a first edge of the top circuitry layer, a second edge of the ground plane layer and a third edge of the bottom layer;

    plating a conductor inside the hole, thereby connecting the first edge, the second edge and the third edge with the conductor;

    removing the plating from the first edge;

    attaching the bottom layer to the pallet;

    placing the component in the hole; and

    soldering the component to the top circuitry layer.

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