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Bump and method of forming bump

  • US 20030101584A1
  • Filed: 01/16/2003
  • Published: 06/05/2003
  • Est. Priority Date: 06/09/1998
  • Status: Active Grant
First Claim
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1. A method of forming on a conductor a bump used for electric contact with an electric part, comprising:

  • arranging on said conductor a conductive material including a substantially same electric characteristic as said bump by fusing; and

    forming said arranged conductive material into a desired shape by die pressing with a bump forming die in which a recess having a given shape is defined.

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