Method of manufacturing optical semiconductor device

• US 20030102483A1
• Filed: 12/02/2002
• Published: 06/05/2003
• Est. Priority Date: 12/04/2001
• Status: Abandoned Application

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Yaguchi, Noriyuki, Seki, Tomonori, Yamamoto, Toshio, Izumi, Akio
• Application Number:
  US10/307,328
• Publication Number:
  US 20030102483A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optical semiconductor device includes a semiconductor chip, leads electrically connected to the semiconductor chip, and a package through which the leads are projected. In a manufacturing method, a lead frame is formed to have leads and hanging leads that reach the package of the optical semiconductor device. Then, only the leads are cut from the lead frame to form a support frame where the hanging leads support a plurality of the optical semiconductor devices. During the manufacturing process after the support frame is formed, only the support frame is contacted. Therefore, the optical semiconductor devices are processed in a non-contact state during the manufacturing process.

Claims

1. A method of manufacturing an optical semiconductor device comprising the steps of:

forming an optical semiconductor device on a lead frame so that the optical semiconductor device is connected to the lead frame through leads and hanging leads,

cutting the leads so that only the hanging leads are connected to the optical semiconductor device to thereby form a support frame in the lead frame, and

processing the optical semiconductor device by holding the support frame without unnecessarily touching the optical semiconductor device in a remaining process of manufacturing the optical semiconductor device.

2. A method of manufacturing the optical semiconductor device according to claim 1, further comprising the step of forming connection means in the support frame for connecting the support frame to transporting means so that the support frame and the optical semiconductor device are transported by the transporting means through the connection means in the remaining process of manufacturing the optical semiconductor device.

3. A method of manufacturing the optical semiconductor device according to claim 1, further comprising the step of forming positioning means in the support frame for placing the support frame and the optical semiconductor device at a predetermined position in the remaining process of manufacturing the optical semiconductor device.

4. A method of manufacturing the optical semiconductor device according to claim 1, further comprising at least one of the steps of housing, storing, inspecting, and transporting the optical semiconductor device without touching the same.

5. A method of manufacturing the optical semiconductor device according to claim 1, wherein said further processing includes the steps of transporting the optical semiconductor device to a circuit board by only holding the support frame, positioning the optical semiconductor device at a predetermined position relative to the circuit board by only holding the support frame, fixing the optical semiconductor device on the circuit board, and cutting the hanging leads so that the support frame is separated from the optical semiconductor device.

6. A method of manufacturing the optical semiconductor device according to claim 1, wherein a plurality of said hanging leads projects toward the semiconductor device to hold the semiconductor device to the support frame.