×

Semiconductor device and method for manufacturing

  • US 20030102551A1
  • Filed: 12/31/2002
  • Published: 06/05/2003
  • Est. Priority Date: 07/13/2000
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device, comprising:

  • an electrode pad which is formed on a substrate;

    a covering film which is formed on said substrate and comprises an opening on top of said electrode pad;

    a rewiring pattern which is formed on said covering film and makes contact with said electrode pad at said opening;

    a trench which is formed in the region of the interlayer film where said rewiring pattern is not formed;

    a bump which is formed on top of said rewiring pattern; and

    a sealing film which covers said rewiring pattern and said trench, and is formed in such a way that the upper end of the bump is exposed.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×