In-situ cap and method of fabricating same for an integrated circuit device
First Claim
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1. A micromachined device with an in-situ cap comprising:
- a substrate;
a micromachined element on said substrate;
an in-situ cap integral with said substrate and covering said device; and
at least one conductor extending from said element under said cap through said substrate to an external terminal.
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Abstract
An in-situ cap for an integrated circuit device such as a micromachined device and a method of making such a cap by fabricating an integrated circuit element on a substrate; forming a support layer over the integrated circuit element and forming a cap structure in the support layer covering the integrated circuit element.
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Citations
31 Claims
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1. A micromachined device with an in-situ cap comprising:
- a substrate;
a micromachined element on said substrate;
an in-situ cap integral with said substrate and covering said device; and
at least one conductor extending from said element under said cap through said substrate to an external terminal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- a substrate;
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13. A micromachined device with an in-situ cap comprising:
- a substrate;
a micromachined element on said substrate;
an in-situ cap integral with said substrate and covering said device;
said micromachined element including an optical device and an optical port for accessing said optical device. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
- a substrate;
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21. A micromachined device with an in-situ cap comprising:
- a substrate;
a micromachined element on said substrate;
an in-situ cap integral with said substrate and covering said device; and
a liquid disposed in said cap. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28)
- a substrate;
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29. A integrated circuit device with an in-situ cap comprising:
- a substrate;
a integrated circuit element on said substrate;
an in-situ cap integral with said substrate and covering said element; and
at least one conductor extending from said element under said cap through said substrate to an external terminal.
- a substrate;
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30. A integrated circuit device with an in-situ cap comprising:
- a substrate;
a integrated circuit element on said substrate;
an in-situ cap integral with said substrate and covering said element;
said integrated circuit element including an optical device and an optical port for accessing said optical device.
- a substrate;
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31. A integrated circuit device with an in-situ cap comprising:
- a substrate;
a integrated circuit element on said substrate;
an in-situ cap integral with said substrate and covering said element; and
a liquid disposed in said cap.
- a substrate;
Specification