Ceramic substrate
First Claim
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1. A ceramic substrate comprising:
- a conductor layer on the surface and/or inside of said ceramic substrate; and
a through-hole connected electrically to said conductor layer, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate.
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Abstract
The present invention provides a ceramic substrate for use in an apparatus for manufacturing and inspecting semiconductors. The ceramic substrate comprises a through-hole having excellent tolerance performance against a drawing stress applied to an external terminal pin. The through-hole is provided with a projection which protrudes into the ceramic substrate made of aluminum nitride as primary component.
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Citations
4 Claims
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1. A ceramic substrate comprising:
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a conductor layer on the surface and/or inside of said ceramic substrate; and
a through-hole connected electrically to said conductor layer, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate. - View Dependent Claims (2, 3, 4)
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Specification