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Ceramic substrate

  • US 20030104186A1
  • Filed: 01/16/2003
  • Published: 06/05/2003
  • Est. Priority Date: 11/10/1999
  • Status: Active Grant
First Claim
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1. A ceramic substrate comprising:

  • a conductor layer on the surface and/or inside of said ceramic substrate; and

    a through-hole connected electrically to said conductor layer, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate.

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