Ceramic substrate

• US 20030104186A1
• Filed: 01/16/2003
• Published: 06/05/2003
• Est. Priority Date: 11/10/1999
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Ito, Yasutaka
• Granted Patent: US 6,919,124 B2
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

The present invention provides a ceramic substrate for use in an apparatus for manufacturing and inspecting semiconductors. The ceramic substrate comprises a through-hole having excellent tolerance performance against a drawing stress applied to an external terminal pin. The through-hole is provided with a projection which protrudes into the ceramic substrate made of aluminum nitride as primary component.

Claims

1. A ceramic substrate comprising:

a conductor layer on the surface and/or inside of said ceramic substrate; and

a through-hole connected electrically to said conductor layer, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate.

2. The ceramic substrate according to claim 1, further comprising:

a conductor layer on the surface of said ceramic substrate; and

a through-hole connected electrically to said conductor layer, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate, whereby said ceramic substrate functions as a wafer prober.

3. The ceramic substrate according to claim 1, further comprising:

a heat generation body as a conductor layer inside said ceramic substrate; and

a through-hole connected electrically to said heat generation body, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate, whereby said ceramic substrate functions as a heater.

4. The ceramic substrate according to claim 1, further comprising:

an electrostatic electrode as a conductor layer inside said ceramic substrate; and

a through-hole connected electrically to said electrostatic electrode, wherein a projection is formed on a side wall of said through-hole so as to protrude into said ceramic substrate, whereby said ceramic substrate functions as an electrostatic chuck.