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Low temperature hermetic sealing method having passivation layer

  • US 20030104651A1
  • Filed: 11/14/2002
  • Published: 06/05/2003
  • Est. Priority Date: 12/04/2001
  • Status: Active Grant
First Claim
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1. A low temperature hermetic sealing method having a passivation layer, the method comprising:

  • depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame;

    depositing a first protection layer for preventing oxidation on the solder layer and forming a lid;

    preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device; and

    assembling, heating, and sealing the lid and the package base.

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