System and method for managing work in process (WIP) handling instructions

• US 20030105541A1
• Filed: 11/30/2001
• Published: 06/05/2003
• Est. Priority Date: 11/30/2001
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Hsu, Chi-Sen, Liao, Yun-Wen, Feng, Shu-Ling
• Application Number:
  US09/998,343
• Publication Number:
  US 20030105541A1
• Time in Patent Office: Days
• US Class Current: 700/100
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling

Abstract

Within both a system for managing a work in process (WIP) workload lot within a fabrication facility and a method for managing the work in process (WIP) workload lot within the fabrication facility, there is provided for direct customer access for requesting a change in handling instructions for the work in process (WIP) workload lot within the fabrication facility. The direct customer access when requesting the change provides for enhanced flexibility when operating the fabrication facility.

Claims

1. A computer assisted system for managing a work in process workload comprising:

means for storing identifying information for a work in process workload lot;

means for accessing the identifying information for the work in process workload lot;

means for requesting and effecting a change in production of the work in process workload lot after accessing the identifying information for the work in process workload lot, wherein the means for requesting the change in production of the work in process workload lot provides for direct access by a customer.

2. The system of claim 1 wherein the system is employed within a fabrication facility selected from the group consisting of electrical fabrication facilities, chemical fabrication facilities and mechanical fabrication facilities.

3. The system of claim 1 wherein the system is employed within a microelectronic fabrication facility selected from the group consisting of integrated circuit microelectronic fabrication facilities, ceramic substrate microelectronic fabrication facilities, solar cell optoelectronic microelectronic fabrication facilities, sensor image array optoelectronic microelectronic fabrication facilities and display image array optoelectronic microelectronic fabrication facilities.

4. The system of claim 1 wherein the change in production of the work in process workload lot is requested directly by the customer without an intervening approval by a customer engineer.

5. The system of claim 1 wherein the computer assisted system is accessible by the customer through a distributed communications network.

6. The system of claim 1 wherein the computer assisted system is accessible by the customer through an Internet distributed communications network.

7. A method for managing a work in process workload comprising:

providing a computer assisted system for managing a work in process workload lot, the computer assisted system comprising;

means for storing identifying information for the work in process workload lot;

means for accessing the identifying information for the work in process workload lot; and

means for requesting and effecting a change in production of the work in process workload lot after accessing the identifying information for the work in process workload lot, wherein the means for requesting the change in production of the work in process workload lot provides for direct access by a customer; and

requesting the change in production of the work in process workload lot directly by the customer.

8. The method of claim 7 wherein the system is employed within a fabrication facility selected from the group consisting of electrical fabrication facilities, chemical fabrication facilities and mechanical fabrication facilities.

9. The method of claim 7 wherein the system is employed within a microelectronic fabrication facility selected from the group consisting of integrated circuit microelectronic fabrication facilities, ceramic substrate microelectronic fabrication facilities, solar cell optoelectronic microelectronic fabrication facilities, sensor image array optoelectronic microelectronic fabrication facilities and display image array optoelectronic microelectronic fabrication facilities.

10. The method of claim 7 wherein the change in production of the work in process workload lot is requested directly by the customer without an intervening approval by a customer engineer.

11. The method of claim 7 wherein the computer assisted system is accessible by the customer through a distributed communications network.

12. The method of claim 7 wherein the computer assisted system is accessible by the customer through an Internet distributed communications network.