Accuracy measuring apparatus for machine tool

• US 20030106228A1
• Filed: 10/11/2002
• Published: 06/12/2003
• Est. Priority Date: 10/15/2001
• Status: Active Grant

• Current Assignee: Intelligent Manufacturing Systems International, MORI Seiki Company Limited
• Original Assignee: Intelligent Manufacturing Systems International, MORI Seiki Company Limited
• Inventors: Fujishima, Makoto
• Granted Patent: US 6,839,975 B2
• Time in Patent Office: Days
• US Class Current: 33/502
• CPC Class Codes: B23Q 17/2233 for adjusting the tool relative to the workpiece
• CPC Class Codes: B23Q 17/24 using optics or electromagnetic waves
• CPC Class Codes: G01B 11/272 using photoelectric detection means

Abstract

The present invention relates to an accuracy measuring apparatus which is capable of efficiently measuring the accuracies of a machine tool at low costs. The accuracy measuring apparatus (1) comprises a laser oscillator (2) attached to a spindle (15) of the machine tool (10) for projecting a light beam having an axis aligning with the axis of the spindle, a CCD camera (3) disposed in opposed relation to the laser oscillator (2) for receiving the light beam projected from the laser oscillator (2) and generating two-dimensional image data, and an analyzer (4) for analyzing the image data to determine the accuracies of the machine tool (10).

Claims

1. An accuracy measuring apparatus for a machine tool, comprising:

light projecting means attached to a spindle of the machine tool for projecting a light beam having an axis aligning with an axis of the spindle;

photographing means disposed in opposed relation to the light projecting means for receiving the light beam projected from the light projecting means and generating two-dimensional image data; and

analyzing means for analyzing the image data to determine an accuracy of the machine tool.

2. An accuracy measuring apparatus as set forth in claim 1, wherein the photographing means is a CCD camera including a plurality of photoelectric conversion devices arranged in a two-dimensional array.

3. An accuracy measuring apparatus as set forth in claim 1, wherein the light projecting means is a laser oscillator for emitting a laser beam.

4. An accuracy measuring apparatus as set forth in claim 1, wherein the analyzing means analyzes a run-out accuracy of the spindle.

5. An accuracy measuring apparatus as set forth in claim 1, wherein the analyzing means analyzes a feed linearity of a feed mechanism of the machine tool.