Radio frequency module and method for manufacturing the same
First Claim
1. A radio frequency module comprising:
- a dielectric substrate having first and second main surfaces and a rectangular penetration hole opening in the first and second main surfaces;
first and second conductors for grounding respectively provided on the first and second main surfaces to cover the openings of the penetration hole; and
a conductor layer formed on opposite wall surfaces of the penetration hole in the dielectric substrate;
wherein a waveguide structure is formed by a space surrounded by the first and second conductors and the conductor layer.
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Accused Products
Abstract
A rectangular penetration hole is formed opening in the opposite two main surfaces of a first dielectric substrate. Conductors for grounding are respectively formed on the main surfaces, to cover the openings of the penetration hole. A conductor layer is formed on opposite inner walls in the penetration hole of the dielectric substrate. A waveguide is structured by a space surrounded by the conductors and the conductor layers. The waveguide is magnetically coupled with an input/output line on a second dielectric substrate through a coupling slot. Because a waveguide has walls made continuous in the dielectric substrate, a low-loss waveguide can be realized. Hence, a high-performance radio frequency module can be realized.
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Citations
23 Claims
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1. A radio frequency module comprising:
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a dielectric substrate having first and second main surfaces and a rectangular penetration hole opening in the first and second main surfaces;
first and second conductors for grounding respectively provided on the first and second main surfaces to cover the openings of the penetration hole; and
a conductor layer formed on opposite wall surfaces of the penetration hole in the dielectric substrate;
wherein a waveguide structure is formed by a space surrounded by the first and second conductors and the conductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A radio frequency module comprising:
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a metal plate having a penetration hole; and
first and second conductors for grounding respectively provided on first and second main surfaces of the metal plate;
wherein a waveguide structure is formed by a space surrounded by the first and second conductors for grounding and a wall surface of the penetration hole. - View Dependent Claims (9, 10, 11, 12)
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13. A radio frequency module comprising:
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a copper plate having a penetration hole in an arbitrary position and a multi-layer dielectric film;
a buried through-hole provided in an arbitrary position of the dielectric film;
an integrated circuit mounted on the buried through-hole;
an antenna or filter circuit formed above the penetration hole; and
a metal cap mounted over said integrated circuit and said antenna or filter circuit.
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14. A method for manufacturing a radio frequency module comprising the steps of:
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forming, by laser forming, a penetration hole having a plurality of rectangular portions coupled one with another in a first dielectric substrate formed, on a first main surface, with a conductor for grounding to reach the conductor;
forming a metal film on an inner wall surface of the penetration hole; and
joining a second dielectric substrate forming a conductor for grounding on one surface and an input/output line on the other surface at the surface forming the conductor onto a second main surface of the first dielectric substrate forming the metal film through a conductive double-sided adhesive sheet worked with a blank hole in a form of the penetration hole. - View Dependent Claims (15, 16)
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17. A method for manufacturing a radio frequency module comprising the steps of:
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forming, by laser working, a groove leaving a plurality of rectangular dielectric portions coupled one with another in a liquid crystal polymer substrate forming a conductor for grounding on a first main surface to reach the conductor;
forming a metal plating film on an inner wall surface of the groove;
forming, by plating, a conductor film on a second main surface of the liquid crystal polymer substrate forming the metal plating film; and
forming a slot in a position of the conductor film corresponding to an input/output line, on which a second liquid crystal polymer substrate forming the input/output line is superposed to apply heat and pressure. - View Dependent Claims (18)
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19. A method for manufacturing a radio frequency module comprising:
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a process of forming, by laser working or blanking, a penetration hole having a plurality of rectangular portions coupled one with another in a first liquid crystal polymer substrate;
a process of forming a metal plating film on an inner wall surface of the penetration hole;
a process of forming an input/output line on one main surface of a second liquid crystal polymer substrate;
a process of forming a conductor for grounding on the other main surface of the second liquid crystal polymer substrate in a position corresponding to the input/output line; and
a process of superposing the first and second liquid crystal polymer substrates on the conductor plate to apply heat and pressure thereto. - View Dependent Claims (20)
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21. A method for manufacturing a radio frequency module comprising:
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a process of forming, by machining or wet etching, a penetration hole leaving a plurality of rectangular portions coupled one with another in a metal plate having a conductor for grounding on a first main surface, to reach the conductor;
a process of forming an input/output line on a first main surface of a dielectric substrate;
a process of forming a conductor for grounding on a second main surface of the dielectric substrate in a position corresponding to the input/output line;
a process of placing to oppose, within a vacuum chamber, a second main surface of the metal plate and a surface forming the conductor of the dielectric substrate, and joining the metal plate and the dielectric substrate in a vacuum or inert or nitrogen gas by applying heat and pressure. - View Dependent Claims (22)
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23. A method for manufacturing a radio frequency module comprising the steps of:
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cutting a dielectric substrate into a form having a plurality of rectangular portions coupled one with another;
forming a metal film on an outer peripheral wall surface of the dielectric substrate of after cutting; and
surrounding an outer periphery of the dielectric substrate formed with the metal film with synthetic resin materials.
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Specification