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Radio frequency module and method for manufacturing the same

  • US 20030107459A1
  • Filed: 10/28/2002
  • Published: 06/12/2003
  • Est. Priority Date: 10/30/2001
  • Status: Active Grant
First Claim
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1. A radio frequency module comprising:

  • a dielectric substrate having first and second main surfaces and a rectangular penetration hole opening in the first and second main surfaces;

    first and second conductors for grounding respectively provided on the first and second main surfaces to cover the openings of the penetration hole; and

    a conductor layer formed on opposite wall surfaces of the penetration hole in the dielectric substrate;

    wherein a waveguide structure is formed by a space surrounded by the first and second conductors and the conductor layer.

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