Method for fabricating surface acoustic wave filter packages

• US 20030109077A1
• Filed: 04/11/2002
• Published: 06/12/2003
• Est. Priority Date: 12/07/2001
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Kim, Jae Myung, Kim, Tae Hoon, Park, Joo Hun, Park, Chan Wang
• Granted Patent: US 6,670,206 B2
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/02913 Measures for shielding against electromagnetic fields shielding of electrical components in general H05K9/00
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1078 the enclosure being defined by a foil covering the non-active sides of the SAW device
• CPC Class Codes: H03H 9/1085 the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Abstract

Disclosed is a method for simply fabricating plural surface acoustic wave filter chip packages in large quantities comprising the steps of providing a wafer, on the surface of which plural surface acoustic wave filter chips are formed, and a package substrate, on the surface of which mounting portions corresponding to surface acoustic wave filter chips are formed; providing underfill on the package substrate; mounting the wafer on the package substrate; removing wafer portions between surface acoustic wave filter chips; forming metal shield layers on outer walls of separated surface acoustic wave filter chips; molding a resin on outer walls of surface acoustic wave filter chips coated with metal layers; and dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.

Claims

1. A method for fabricating plural surface acoustic wave filter chip packages, comprising the steps of:

providing a wafer and a package substrate, said wafer having plural surface acoustic wave filter chips formed thereon, said package substrate being provided with mounting portions at positions corresponding to the positions of surface acoustic wave filter chips on the wafer;

forming underfill on the mounting portions of the package substrate;

mounting the wafer on the package substrate in such a way as to connect the surface acoustic wave filter chips to the mounting portions;

removing wafer portions between surface acoustic wave filter chips to separate the surface acoustic wave filter chips from each other;

overlaying a metal shield layer on outer sides of the separated surface acoustic wave filter chips;

molding a blanket of resin over the metal shield layer covering the surface acoustic wave filter chips; and

dividing the package substrate molded with resin into individual surface acoustic wave filter chip packages.

2. The method according to claim 1, wherein the mounting portions of the package substrate are respectively provided with bumps for electrically and mechanically connecting surface acoustic wave filter chips to the package substrate.

3. The method according to claim 1, wherein said removing step is carried out by use of an etching process.

4. The method according to claim 1, wherein said removing step is carried out by dicing the wafer with the use of a blade having the substantially same width as the region between surface acoustic wave filter chips so as to separate surface acoustic wave filter chips from each other.

5. The method according to claim 1, wherein the dividing step is carried out by using a blade along with boundaries between the surface acoustic wave filter chip packages.

6. The method according to claim 5, wherein said boundaries between the surface acoustic wave filter chip packages are determined as middles of regions between the surface acoustic wave filter chip packages.

7. The method according to claim 5, wherein the width of the blade used in dividing the package substrate molded with resin is narrower than that used in removing wafer portions between the surface acoustic wave filter chips.

8. The method according to claim 1, wherein the metal shield layer is formed by spraying conductive epoxy over the outer sides of separated surface acoustic wave filter chips.

9. The method according to claim 1, wherein the molding step is carried out by an epoxy molding compound (EMC) top molding process.

10. The method according to claim 1, wherein said resin is any one selected from the group consisting of thermoplastic resin, thermosetting resin, and epoxy resin.

11. The method according to claim 1, wherein the package substrate has a dam structure formed around a rim of the package substrate.