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Ablation instrument and method for cutting, fragmenting and/or removing material

  • US 20030109867A1
  • Filed: 02/15/2002
  • Published: 06/12/2003
  • Est. Priority Date: 12/06/2001
  • Status: Abandoned Application
First Claim
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1. Ablation instrument for cutting, fragmenting and/or removing material of an object, containing a carrier substrate, having at least one resistance-heating layer which is disposed on the substrate and made of doped diamond or diamond like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.

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