Ablation instrument and method for cutting, fragmenting and/or removing material
First Claim
1. Ablation instrument for cutting, fragmenting and/or removing material of an object, containing a carrier substrate, having at least one resistance-heating layer which is disposed on the substrate and made of doped diamond or diamond like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.
1 Assignment
0 Petitions
Accused Products
Abstract
Ablation instrument is provided for cutting, fragmenting and/or removing material of an object, containing a carrier substrate, having at least one resistance-heated layer which is disposed on the substrate and made of doped diamond or diamond-like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.
21 Citations
44 Claims
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1. Ablation instrument for cutting, fragmenting and/or removing material of an object, containing a carrier substrate,
having at least one resistance-heating layer which is disposed on the substrate and made of doped diamond or diamond like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.
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39. Ablation method for cutting, fragmenting of material or removing material from a surface of an object, wherein a resistance-heated layer made of diamond being brought into direct contact with or into the vicinity of the material to be treated and if necessary a liquid is introduced between the diamond layer and the material to be treated;
the diamond layer is contacted with two electrical conductors and is supplied via the electrical conductors with an electrical current in order to heat it in such a manner that liquid, which is located between the diamond layer and the object and/or the material to be treated, forms vapour bubbles at the contact point to the resistance layer. - View Dependent Claims (40)
Specification