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Chip to chip interface for interconnecting chips

  • US 20030110339A1
  • Filed: 12/10/2001
  • Published: 06/12/2003
  • Est. Priority Date: 12/10/2001
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a first ASIC (Application Specific Integrated Circuit) including a first substrate;

    a plurality of On Chip Macros mounted on said first substrate;

    a second ASIC including a second substrate positioned in spaced relationship to said first substrate;

    a plurality of On Chip Macros mounted on said second substrate;

    a Chip to Chip Bus Interface subsystem operatively positioned to provide communications between the first ASIC and the second ASIC; and

    a Chip to Chip Macro subsystem operatively mounted on the first ASIC and the second ASIC, said Chip to Chip Macro subsystem aggregating all communications between at least a pair of On Chip Macros one of each being located on the first substrate and the second substrate onto the Chip to Chip Bus Interface subsystem.

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