Surface mount ceramic package

• US 20030111714A1
• Filed: 12/03/2001
• Published: 06/19/2003
• Est. Priority Date: 12/03/2001
• Status: Active Grant

• Current Assignee: Dielectric Laboratories, Inc.
• Original Assignee: Dover Capital Formation Corporation
• Inventors: Bates, David A., Rowden, Brian L., Oot, Stephen J., Street, Robert J.
• Granted Patent: US 6,635,958 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10161 with a rectangular active surface
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10727 : Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Claims

1. A surface mount ceramic package for housing an integrated circuit die and adapted to be mounted directly onto a printed circuit board on which there are metallized traces;

comprising

a flat core formed of a material that is thermally and electrically conductive;

a first ceramic layer disposed on said core and having a cavity formed therein in which said die lies on said core with the first ceramic layer surrounding said cavity;

a plurality of metallized feed-throughs formed on an upper surface of said first ceramic layer, each feed-through extending to an inner metallized pad adjacent said cavity;

a second ceramic layer disposed on the upper surface of said first ceramic layer and encircling said cavity and covering said metallized feed-throughs but leaving said inner pads available for bonding to said die;

outer metallized pads on a lower surface of said first ceramic layer for connecting electrically onto the metallized traces of said printed circuit board; and

conductor means within said first ceramic layer connecting said outer metallized pads to respective ones of said feed-throughs;

and wherein said core has one or more peripheral access portions that permit access to the lower surface of said first ceramic layer at locations of said outer pads to permit the outer pads to be connected directly to the printed circuit board metal traces.

2. The surface mount ceramic package according to claim 1 wherein a portion of said first ceramic layer where said outer pads are located extends down into one or more of said access portions.

3. The surface mount ceramic package according to claim 1 wherein said first and second ceramic layers are co-fired and are each formed of one or more layers of ceramic tape.

4. The surface mount ceramic package according to claim 1 wherein the lower surface of said first ceramic layer is substantially in a plane of an upper surface of said core, such that the outer pads are disposed above a lower surface of said core.

5. The surface mount ceramic package according to claim 1 wherein said conductor means includes conductive vias extending vertically through said first ceramic layer.

6. The surface mount ceramic package according to claim 1 wherein said second ceramic layer has a greater internal dimension at said cavity than said first ceramic layer, such as to create one or more ledges adjacent said cavity where said inner pads are located.

7. The surface mount ceramic package according to claim 1 wherein said feed throughs are buried beneath said second ceramic layer except at said inner pads.

8. The surface mount ceramic package according to claim 1 wherein said peripheral access portions include at least one cutout at the periphery of said core.

9. The surface mount ceramic package according to claim 1 wherein said peripheral access portions include a marginal portion of the core which the first ceramic layer overhangs.