Solid-state imaging apparatus and manufacturing method thereof

• US 20030112714A1
• Filed: 11/29/2002
• Published: 06/19/2003
• Est. Priority Date: 11/30/2001
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Harazono, Fumikazu
• Granted Patent: US 7,029,186 B2
• Time in Patent Office: Days
• US Class Current: 369/18
• CPC Class Codes: G02B 6/36 Mechanical coupling means G02B6/255, G02B6/42 take precedence
• CPC Class Codes: G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
• CPC Class Codes: G11B 7/22 Apparatus or processes for the manufacture of optical heads, e.g. assembly
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A light-transmitting member is previously formed, and then integrally molded during a process of molding a structure member. A solid-state imaging apparatus has: the structure member configured by an insulating resin and having a through-opening portion; a wiring portion which is formed on the surface of the structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member which is placed to cover the through-opening portion with being separated from the solid-state imaging element by a predetermined distance The light-transmitting member is configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin, and integrally molded with the structure member to be embedded at a peripheral portion into the structure member.

Claims

1. A solid-state imaging apparatus comprising:

a structure member made of an insulating resin and having a through-opening portion;

a wiring portion formed on a surface of said structure member;

a solid-state image pickup element connected to said wiring portion and attached to said structure member to cover the through-opening portion; and

a light-transmitting member attached to said structure member to cover the through-opening portion with being separated from said solid-state image pickup element by a predetermined distance,

wherein said light-transmitting member being configured by a plate-like member made of a material which is smaller in coefficient of linear expansion than the insulating resin of said structure member, and integrally molded with said structure member to be embedded at a peripheral portion into said structure member.

2. The solid-state imaging apparatus according to claim 1, wherein said structure member comprises:

a solid-state image pickup element mounting portion where said solid-state image pickup element is attached; and

a penetrated hole communicating with the through-opening portion provided in a region positioned between a solid-state image pickup element mounting portion and a light-transmitting member embedding portion.

3. The solid-state imaging apparatus according to claim 1, wherein said structure member comprises:

a leg portion on which said wiring portion is to be formed; and

a cylindrical body portion disposed on said leg portion,

wherein the through-opening portion is formed between said body portion and said leg portion.

4. The solid-state imaging apparatus according to claim 1, wherein said light-transmitting member is configured by forming a dielectric thin film of a multilayer structure on a surface of quartz glass.

5. The solid-state imaging apparatus according to claim 1, wherein said light-transmitting member is made of a thermosetting resin.

6. The solid-state imaging apparatus according to claim 1, wherein said light-transmitting member is an optical filter.

7. A method of manufacturing a solid-state imaging apparatus, comprising:

forming a light-transmitting member by molding a material smaller in coefficient of linear expansion than an insulating resin constituting a structure member into a plate-like member;

integrally molding the light-transmitting member and the structure member having a through-opening portion and a solid-state image pickup element attaching portion to which a solid-state image pickup element is attached to close the through-opening portion so that the light-transmitting member is disposed to cover the through-opening portion to be separated from said solid-state image pickup element attaching portion by a predetermined distance and the periphery of the light-transmitting member is embedded in the structure member, by conducting a molding process by using said insulating resin as a material after placing said light-transmitting member in molding dies;

forming a wiring portion on said structure member; and

attaching said solid-state image pickup element to said solid-state image pickup element attaching portion.

8. The method of manufacturing a solid-state imaging apparatus according to claim 7, wherein the structure member is formed by injection molding and made of a thermoplastic insulating resin.

9. The method of manufacturing a solid-state imaging apparatus according to claim 7, further comprising forming a penetrated hole in the structure member to face the through-opening portion.

10. The method of manufacturing a solid-state imaging apparatus according to claim 9, wherein said penetrated hole is formed at each of positions where the penetrated holes face each other across said through-opening portion in a direction perpendicular to an injection direction of the thermoplastic resin.