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Method of forming resist pattern, and exposure device

  • US 20030117608A1
  • Filed: 12/12/2002
  • Published: 06/26/2003
  • Est. Priority Date: 03/27/2000
  • Status: Active Grant
First Claim
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1. A method of forming a resist pattern comprising the steps of:

  • subjecting a resist, which is applied on a surface of an object to be processed, to pattern exposure in which a first exposure amount for forming a pattern is applied to the resist;

    forming a resist pattern by developing the resist;

    subjecting the resist pattern to a second exposure in which a second exposure amount, which adjusts a shrinkage rate of the resist pattern, is applied to the resist pattern; and

    subjecting the resist to a bake process at a temperature at which the resist flows.

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