WDM add/drop multiplexer module
First Claim
1. A casing member for a WDM add/drop multiplexer unit, the casing member comprising:
- a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.
9 Assignments
0 Petitions
Accused Products
Abstract
A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for maintaining a controlled temperature environment inside of the component.
-
Citations
46 Claims
-
1. A casing member for a WDM add/drop multiplexer unit, the casing member comprising:
-
a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 41, 44)
-
- 19. A chassis member for carrying at least one circuit board, wherein the chassis member is adapted, in use, to function as a heatsink for a beat generating component mounted on the circuit board.
-
23. A WDM multiplexer module comprising:
-
a housing, a chassis member located substantially inside the housing and adapted to function as a heat sink, a heat sink structure extending from the housing and in thermal communication with the chassis member, a first thermoelectric (TE) device in thermal communication with the chassis member, at least one heat generating electrical component in thermal communication with the chassis member, and a control unit arranged, in use, to maintain a controlled temperature environment inside the housing utilising the heat sink structure, the TE device, and the heat generating electrical component and utilising the chassis member as a thermal communication medium. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 43, 46)
-
-
35. A method of thermal control of a WDM multiplexer module, the method comprising the steps of:
-
maintaining a first stage controlled temperature environment inside the module and maintaining a second stage controlled temperature environment in at least a portion of the inside of the module, wherein temperature variations in the second stage controlled temperature environment are smaller than temperature variations of the first stage controlled temperature environment. - View Dependent Claims (36, 37, 38, 39, 40)
-
Specification