Structure for multi-layer conductive via and circuit and method for making same

• US 20030118797A1
• Filed: 12/26/2001
• Published: 06/26/2003
• Est. Priority Date: 12/26/2001
• Status: Abandoned Application

• Current Assignee: Interface Data Systems, Inc. (Microchip Technology Incorporated)
• Original Assignee: Interface Data Systems, Inc. (Microchip Technology Incorporated)
• Inventors: Fluman, Robin, Gann, Ken
• Application Number:
  US10/033,405
• Publication Number:
  US 20030118797A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/09518 Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
• CPC Class Codes: H05K 2201/09536 Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4635 laminating flexible circuit boards using additional insulating adhesive materials between the boards
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A multi-layer conductive via structure and multi-layer circuit structure containing such multi-layer via structure are described along with the methods for making the structures. The structures include conductive material filled opening(s) located within flexible substrate layers that are supported by an adhesive layer.

Claims

1. A multi-layer conductive via comprising:

a) a first layer of flexible substrate;

b) a conductive ink overlying said first layer;

c) an adhesive layer having an opening therein overlying said conductive ink;

d) a second layer of flexible substrate having an opening therein overlying said adhesive layer such that said openings are aligned with one another; and

e) a conductive material layer filling said aligned openings.

2. The multi-layer conductive via of claim 1 further comprising a conductive trace overlying said second layer such that said conductive trace lies in contact with said material layer.

3. The multi-layer conductive via of claim 1 wherein said conductive ink preferably comprises at least one of a silver based ink, a carbon ink, and two part cure conductive epoxy.

4. The multi-layer conductive via of claim 1 wherein said adhesive layer preferably comprises an acrylic adhesive.

5. The multi-layer conductive via of claim 1 wherein said flexible substrate preferably comprises a polymer.

6. The multi-layer conductive via of claim 5 wherein said polymer comprises at least one of a polyester or a polycarbonate.

7. The multi-layer conductive via of claim 1 wherein said conductive material layer preferably comprises a conductive ink.

8. The multi-layer conductive via of claim 7 wherein said conductive ink preferably comprises at least one of a silver based ink and a carbon ink.

9. The multi-layer conductive via of claim 7 wherein said adhesive preferably comprises an acrylic adhesive.

10. A multi-layer circuit comprising:

a) a first substrate layer;

b) a conductive circuit formed on said substrate layer using a conductive ink;

c) an adhesive layer having at least one opening formed therein overlying said conductive circuit on said substrate;

d) a flexible layer having at least one opening therein overlying said adhesive layer such that at least one of said openings in said flexible layer is aligned with at least one of said openings in said adhesive layer;

e) a second conductive circuit formed on said flexible layer wherein said circuit lies adjacent to at least one set of aligned openings; and

f) a conductive material layer filling said aligned openings.

11. The multi-layer circuit of claim 10 wherein said conductive circuit preferably comprises at least one of a silver based ink, a carbon ink, and two part cure conductive epoxy.

12. The multi-layer circuit of claim 10 wherein said adhesive layer preferably comprises acrylic adhesive.

13. The multi-layer circuit of claim 10 wherein said substrate layer and said flexible layer preferably comprise a polymer.

14. The multi-layer circuit of claim 13 wherein said polymer comprises at least one of a polyester or a polycarbonate

15. The multi-layer conductive via of claim 10 wherein said conductive material layer preferably comprises a conductive ink.

16. The multi-layer conductive via of claim 15 wherein said conductive ink preferably comprises at least one of a silver based ink and a carbon ink.

17. The multi-layer conductive via of claim 15 wherein said adhesive preferably comprises an acrylic adhesive.

18. The multi-layer circuit of claim 10 further comprising:

a) a plurality of adhesive layers each having at least one opening therein and each overlying a flexible layer having at least one opening therein;

b) a plurality of flexible layers each having at least one opening therein and each overlying an adhesive layer such that at least one of said openings in said flexible layers is aligned with at least one of said openings in said adhesive layers;

c) a plurality of conductive circuits formed on each of said flexible layers such that each of said circuits lies adjacent to at least one of said openings in said flexible layers; and

d) a plurality of conductive material layers filling each of said aligned openings.

19. A method for making a multi-layer conductive via comprising the steps of:

a) forming a first flexible layer;

b) applying a conductive ink to said first layer;

c) applying an adhesive layer having at least one opening therein over said first layer and said conductive ink such that said opening in said adhesive layer overlies said conductive ink;

d) applying a second flexible layer having at least one opening therein over said adhesive layer such that at least one opening in said second flexible layer overlies at least one opening in said adhesive layer; and

e) filling said aligned openings with a conductive material layer.

20. The method of claim 19 further comprising the step of forming a conductive trace on said second flexible layer such that said conductive trace is in contact with said conductive material layer.

21. The method of claim 19 wherein said step of applying a conductive ink to said first layer comprises at least one of screen printing said ink, stencil printing said ink, or directly applying said ink using a syringe dispenser.

22. The method of claim 19 wherein said steps of applying said adhesive layer and applying said second flexible layer each comprise the step of applying pressure to said respective layers.

23. The method of claim 22 wherein said step of applying pressure comprises applying pressure with at least one of a hand roller or opposing machine rollers.

24. The method of claim 19 further comprising the step of curing said conductive material layer at an elevated temperature.

25. The method of claim 19 wherein said step of filling said aligned openings with a conductive material layer comprises the step of filling said aligned openings with a two part cure conductive epoxy which cures at room temperature.

26. A method for making a multi-layer circuit comprising the steps of:

a) forming a first substrate layer;

b) forming a conductive circuit on said substrate layer using a conductive ink;

c) applying an adhesive layer having at least one opening therein over said substrate layer and conductive circuit such that the opening in said adhesive layer overlies said conductive circuit;

d) applying a flexible layer having at least one opening therein over said adhesive layer such that at least one opening in said adhesive layer and at least one opening in said flexible layer are aligned with one another;

e) forming a second conductive circuit on said flexible layer such that said second conductive circuit lies adjacent to at least one set of aligned openings in said adhesive and flexible layers; and

f) filling said aligned openings with a conductive material.

27. The method of claim 26 further comprising the step of alternately applying adhesive layers having at least one opening and flexible layers having at least one opening and at least one conductive circuit formed thereon such that at least one set of openings in said adhesive and flexible layers are aligned with one another and at least one set of aligned openings lies adjacent to said at least one conductive via.

28. The method of claim 26 wherein said step of applying a conductive ink to said first substrate layer comprises at least one of screen printing said ink, stencil printing said ink, or directly applying said ink using a syringe dispenser.

29. The method of claim 26 wherein said steps of applying said adhesive layer and applying said flexible layer each comprise the step of applying pressure to said respective layers.

30. The method of claim 29 wherein said step of applying pressure comprises applying pressure with at least one of a hand roller or opposing machine rollers.

31. The method of claim 26 further comprising the step of curing said conductive material at an elevated temperature.

32. The method of claim 26 wherein said step of filling said aligned openings with a conductive material comprises the step of filling said aligned openings with a two part cure conductive epoxy.