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Structure for multi-layer conductive via and circuit and method for making same

  • US 20030118797A1
  • Filed: 12/26/2001
  • Published: 06/26/2003
  • Est. Priority Date: 12/26/2001
  • Status: Abandoned Application
First Claim
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1. A multi-layer conductive via comprising:

  • a) a first layer of flexible substrate;

    b) a conductive ink overlying said first layer;

    c) an adhesive layer having an opening therein overlying said conductive ink;

    d) a second layer of flexible substrate having an opening therein overlying said adhesive layer such that said openings are aligned with one another; and

    e) a conductive material layer filling said aligned openings.

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