Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
First Claim
1. A method of vacuum laminating a dry film photoresist-forming layer onto a prelaminated printed circuit board or other substrate (200) which prevents premature tacking of the dry film to the board or substrate, comprising:
- (a) placing the board or substrate in a first vacuum lamination chamber of a vacuum laminator (12) having two independent vacuum lamination chambers (18,20);
(b) drawing a vacuum in said first chamber (18) at ambient temperature for a time sufficient to evacuate substantially all of the air from between the dry film and the surface of the board or substrate and place the dry film in intimate contact with the surface of the board or substrate;
(c) placing the board or substrate in a second vacuum lamination chamber (20) of the vacuum laminator, said second chamber being independent of said first chamber; and
, (d) applying sufficient heat to the dry film on the board or substrate in said second chamber (20) to cause the dry film to adequately flow and then sufficient mechanical pressure on the board or substrate to thereby force the heated laminate to conform closely to the surface contours of the board or substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
An improved method of and apparatus that is continuously automatically operative in an in-line system is described for applying under vacuum, heat and mechanical pressure a dry film photoresist-forming layer to printed circuit boards (200) that already have been prelaminated by the loose application thereto of the dry film resist as discrete cut sheets within the confines of the surface of the boards whereby a laminate without entrapped air bubbles and closely conforming to the raised circuit traces and irregular surface contours of the printed circuit board is obtained. Featured is a conveyorized vacuum applicator (12) comprising two independent vacuum lamination chambers (18,20) in end-to-end relation. The first vacuum chamber operates at ambient temperature to draw off all of the air entrapped between the dry film resist and the surface of the printed circuit board at conditions that do not result in premature tacking of the dry film to the surface of the board. Then, in the second vacuum chamber, the photoresist-forming layer is immediately laminated to the printed circuit board under heat and mechanical pressure. The forgoing reduces or eliminates common lamination defects such as premature resist tacking and the attendant need to repair or rework the printed circuit board.
34 Citations
20 Claims
-
1. A method of vacuum laminating a dry film photoresist-forming layer onto a prelaminated printed circuit board or other substrate (200) which prevents premature tacking of the dry film to the board or substrate, comprising:
-
(a) placing the board or substrate in a first vacuum lamination chamber of a vacuum laminator (12) having two independent vacuum lamination chambers (18,20);
(b) drawing a vacuum in said first chamber (18) at ambient temperature for a time sufficient to evacuate substantially all of the air from between the dry film and the surface of the board or substrate and place the dry film in intimate contact with the surface of the board or substrate;
(c) placing the board or substrate in a second vacuum lamination chamber (20) of the vacuum laminator, said second chamber being independent of said first chamber; and
,(d) applying sufficient heat to the dry film on the board or substrate in said second chamber (20) to cause the dry film to adequately flow and then sufficient mechanical pressure on the board or substrate to thereby force the heated laminate to conform closely to the surface contours of the board or substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method according to claim wherein the dry film is a solder mask or a primary imaging photoresist.
-
10. Apparatus for vacuum laminating a dry film photoresist-forming layer onto a prelaminated printed circuit board or other substrate which prevents premature tacking of the dry film to the board or substrate, comprising:
-
a vacuum laminator (12) having two independent vacuum lamination chambers (18,20);
the first vacuum lamination chamber (18) being operated at ambient temperature while a vacuum is drawn to evacuate all of the air between the loosely applied prelaminated dry film and the surface of the board or substrate, thereby to place the dry film in intimate contact with the board or substrate without causing the dry film to prematurely adhere to the surface before all of the air can be evacuated; and
,the second vacuum lamination chamber (20) being operated under heat and mechanical pressure to laminate the evacuated dry film to the board or substrate, thereby to ensure complete conformance of the dry film to the surface contours of the board or substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification