Molded/integrated touch switch/control panel assembly and method for making same

• US 20030121767A1
• Filed: 10/15/2002
• Published: 07/03/2003
• Est. Priority Date: 11/20/2001
• Status: Active Grant

• Current Assignee: Touchsensor Technologies LLC (Methode Electronics Incorporated)
• Original Assignee: Touchsensor Technologies LLC (Methode Electronics Incorporated)
• Inventors: Caldwell, David W.
• Granted Patent: US 6,897,390 B2
• Time in Patent Office: Days
• US Class Current: 200/512
• CPC Class Codes: A47B 57/00 Cabinets, racks or shelf units, characterised by features for adjusting shelves or partitions shelf units with stackable uprights A47B87/00; details of cabinets, racks or shelf units in general A47B96/00; brackets adjustable in themselves A47B96/07
• CPC Class Codes: A47B 96/025 Shelves with moving elements, e.g. movable extensions or link elements cabinets, racks or shelf units enabling enlargement in height, length or depth A47B45/00
• CPC Class Codes: A47F 3/06 with movable or removable shelves or receptacles A47F3/0486 takes precedence; display racks with movable parts A47F5/0081
• CPC Class Codes: A47F 5/0043 Show shelves shelves in general A47B96/02; brackets or similar shelf-supporting means A47B96/06; advertising or price indication G09F
• CPC Class Codes: F25D 2325/022 Shelves made of glass or ceramic
• CPC Class Codes: F25D 2331/803 Bottles
• CPC Class Codes: G09F 3/204 specially adapted to be attached to a shelf or the like
• CPC Class Codes: G09F 9/30 in which the desired character or characters are formed by combining individual elements panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00
• CPC Class Codes: H03K 17/96 Touch switches specially adapted for electronic time-pieces with no moving parts G04G21/08
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: Y10T 29/49105 Switch making

Abstract

The present invention relates to integration of touch switches with integrated thermoformable, injection molded, and other substrates to yield integrated touch switch/control panel assemblies. The ensuant assemblies can include ridges, depressions, anchors, overlaps, rivets and bezels or other housings. They can have any combination of flat and curved surfaces. Further, such assemblies can be incorporated into components of other assemblies, such as automobiles.

Claims

1. A control panel, comprising:

at least one touch responsive switching device;

a substrate defining at least one touch surface corresponding to said at least one touch responsive switching device;

wherein said touch responsive switching device is integrated with said substrate.

2. A control panel, comprising:

at least one touch responsive switching device disposed on a carrier;

a substrate defining at least one touch surface corresponding to said at least one touch responsive switching device;

wherein said carrier is integrated with said substrate.

3. The control panel of claim 2 wherein at least one of said carrier and said substrate comprises a thermoformable material.

4. The control panel of claim 3 wherein at least one of said carrier or said substrate further comprises at least one anchor.

5. The control panel of claim 2 wherein at least one of said carrier and said substrate comprises an injection moldable material.

6. The control panel of claim 5 wherein at least one of said carrier or said substrate further comprises at least one anchor.

7. A method of integrating a touch switch and a control panel, comprising the steps of:

disposing at least one electrode on a carrier;

placing said carrier in abutment with a thermoformable substrate;

thermoforming said substrate onto said carrier.

8. A method of integrating a touch switch and a control panel, comprising the steps of:

disposing at least one electrode on a carrier;

placing said carrier in abutment with a mold adapted for injection molding of a component;

introducing an injection moldable material into said mold so as to encapsulate at least a portion of said carrier.