Organic metal precursor for use in forming metal containing patterned films
First Claim
Patent Images
1. An organic metal precursor represented by the formula (I):
- MmLnL′
oXp
(I) wherein, M is a transition metal atom selected from the group consisting of Ag, Au, Co, Cu, Pd, Ni, Pt, Zn and Cd;
L is a thioether represented by the formula (II) or (III);
wherein in formula (II), each of R1 and R2, independently, is a C1-20 straight-chain, branched-chain or cyclic alkyl, alkenyl or alkynyl group, or an allyl group;
in the formula (III), each of R3 and R4, independently, is a hydrogen atom, or a C1-15 straight-chain or branched-chain alkyl group, and y is an integer from 2 to 10;
L′
is a ligand selected from the group consisting of amines, thiols, selenols and phosphines;
X is an anion selected from the group consisting of halogeno, hydroxide (OH−
), cyanide (CN−
), nitroxyl (NO−
), nitrite (NO2−
), nitrate (NO3−
), azide (N3−
), thiocyanato, isothiocyanato, tetraalkylborate, tetrahaloborate, hexafluorophosphate (PF6−
), triflate (CF3SO3−
), tosylate (Ts−
), sulfate (SO42−
), and carbonate (CO32−
);
each of m and n, independently, is an integer of from 1 to 10; and
each of o and p, independently, is an integer of from 0 to 10.
1 Assignment
0 Petitions
Accused Products
Abstract
An organic metal precursors containing one or more organic ligands bonded to one or more metal atoms, wherein the organic ligand is rapidly dissociated from the metal atom upon exposure to light and degraded leaving a metal or a metal oxide. By using the organic metal precursors, an electroconductive, metal-containing patterned film can be easily deposited on a substrate at room temperature under atmospheric pressure without using photosensitive resins.
26 Citations
7 Claims
-
1. An organic metal precursor represented by the formula (I):
MmLnL′
oXp
(I)wherein, M is a transition metal atom selected from the group consisting of Ag, Au, Co, Cu, Pd, Ni, Pt, Zn and Cd;
L is a thioether represented by the formula (II) or (III);
wherein in formula (II), each of R1 and R2, independently, is a C1-20 straight-chain, branched-chain or cyclic alkyl, alkenyl or alkynyl group, or an allyl group;
in the formula (III), each of R3 and R4, independently, is a hydrogen atom, or a C1-15 straight-chain or branched-chain alkyl group, and y is an integer from 2 to 10;
L′
is a ligand selected from the group consisting of amines, thiols, selenols and phosphines;
X is an anion selected from the group consisting of halogeno, hydroxide (OH−
), cyanide (CN−
), nitroxyl (NO−
), nitrite (NO2−
), nitrate (NO3−
), azide (N3−
), thiocyanato, isothiocyanato, tetraalkylborate, tetrahaloborate, hexafluorophosphate (PF6−
), triflate (CF3SO3−
), tosylate (Ts−
), sulfate (SO42−
), and carbonate (CO32−
);
each of m and n, independently, is an integer of from 1 to 10; and
each of o and p, independently, is an integer of from 0 to 10. - View Dependent Claims (2)
-
3. A method for forming a metal-containing a patterned film on a substrate, comprising the steps of:
-
(a) depositing a film of an organic metal precursor on a surface of the substrate;
(b) placing a photomask of a desired pattern on the film and exposing unmasked areas of the film to a light source to cause the organic metal precursor in the unmasked area to decompose resulting in a patterned film of a metal or a metal oxide; and
(c) washing the substrate with an organic developer capable of dissolving the organic metal precursor to remove the remaining organic metal precursor in masked areas leaving only the patterned film of the metal or the metal oxide. - View Dependent Claims (4, 5, 6, 7)
-
Specification
-
- Resources
Litigation Campaign Assessment
Thank you for your request. You will receive a custom alert email when the Litigation Campaign Assessment is available.
×
-
Current AssigneeSamsung Electronics Co. Ltd.
-
Original AssigneeSamsung Electronics Co. Ltd.
-
InventorsHwang, Soon Taik, Byun, Young Hun, Jung, Won Cheol, Chang, Seok
-
Granted Patent
-
Time in Patent OfficeDays
-
Field of Search
-
US Class Current430/270.1
-
CPC Class CodesC07F 1/005 without C-Metal linkagesC07F 15/0066 without a metal-carbon linkageC07F 15/0093 without a metal-carbon linkageC07F 15/045 without a metal-carbon linkageC07F 15/065 without a metal-carbon linkageC07F 3/003 without C-Metal linkagesC23C 18/08 characterised by the deposi...
