Method of undercutting micro-mechanical device with super-critical carbon dioxide

• US 20030124462A1
• Filed: 12/28/2001
• Published: 07/03/2003
• Est. Priority Date: 12/28/2001
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Miller, Seth Andrian
• Granted Patent: US 6,737,225 B2
• Time in Patent Office: Days
• US Class Current: 430/311
• CPC Class Codes: B81B 3/0005 Anti-stiction coatings
• CPC Class Codes: B81C 1/00476 removing a sacrificial layer B81C1/00912 takes precedence
• CPC Class Codes: B81C 2201/056 Releasing structures at the end of the manufacturing process
• CPC Class Codes: B81C 2201/117 Using supercritical fluid, e.g. carbon dioxide, for removing sacrificial layers
• CPC Class Codes: G03F 7/422 using liquids only G03F7/421 takes precedence

Abstract

A method for removing sacrificial layers during the process of fabricating micro-mechanical devices with a solution of super-critical carbon dioxide. A mixture of super-critical carbon dioxide with other solvents, co-solvents and surfactants is used during the process to remove sacrificial layers. The disclosed method has many advantages over the prior art, including a reduction of capillary forces that can damage the free-standing micro-mechanical superstructures, an absence of plasma induced damage caused by ashing operations, and a reduction in the use of environmentally sensitive chemicals. Another advantage of the disclosed process is that the swelling of the photoresist layers is minimized. The disclosed method may be used to remove sacrificial layers that were deposited during the process of fabricating micro-mechanical devices. The method is also effective to remove a protective recoat layer that is deposited over a micro-mechanical device after it has been fabricated.

Claims

1. An improved method of fabricating a micro-mechanical device, the method comprising:

depositing at least one sacrificial layer on a substrate;

curing the sacrificial layer;

fabricating a micro-mechanical device on the sacrificial layer;

removing the sacrificial layer by immersing the substrate in a cleansing solution comprising super-critical carbon dioxide and a solvent suitable to remove the sacrificial layer.

2. A method according to claim 1, wherein the solvent is selected from the group consisting of methanol, ethanol, ethyl acetate, methyl acetate, acetone, methylethylketone, or methyl tertiary-butyl ether.

3. A method according to claim 1, wherein the sacrificial layer comprises a photoresist solution.

4. A method according to claim 3, wherein the photoresist solution comprises a mixture of novolac resin and a photoresist solvent.

5. A method according to claim 1, wherein the step of curing the sacrificial layer comprises a hard bake.

6. A method according to claim 1, wherein the step of curing the sacrificial layer comprises a soft bake.

7. A method according to claim 1, wherein the step of curing the sacrificial layer comprises UV hardening.

8. A method according to claim 1, wherein the step of removing the sacrificial layer further comprises agitating the cleansing solution with an impeller.

9. A method according to claim 1, wherein the cleansing solution further comprises a non-ionic surfactant solution.

10. A method according to claim 9, wherein the non-ionic surfactant solution comprises a polystyrene-b-poly(1,1-dihydroperfluorooctyl acrylate) copolymer.

11. An improved method of fabricating a micro-mechanical device, the method comprising:

depositing at least one sacrificial layer on a substrate;

curing the sacrificial layer;

fabricating a micro-mechanical device on the first sacrificial layer;

removing the first sacrificial layer;

recoating the micro-mechanical device with a recoat layer of sufficient thickness to completely encapsulate the micro-mechanical device;

curing the recoat layer;

removing the recoat layer by immersing the substrate in a cleansing solution comprising super-critical carbon dioxide and a solvent suitable to remove the sacrificial layer.

12. A method according to claim 11, wherein the solvent is selected from the group consisting of methanol, ethanol, ethyl acetate, methyl acetate, acetone, methylethylketone, or methyl tertiary-butyl ether.

13. A method according to claim 11, wherein the recoat layer comprises a mixture of novolac resin and a photoresist solvent.

14. A method according to claim 13, wherein the recoat layer does not contain a photoactive compound.

15. A method according to claim 11, wherein the step of curing the recoat layer comprises a hard bake.

16. A method according to claim 11, wherein the step of curing the recoat layer comprises a soft bake.

17. A method according to claim 11, wherein the step of curing the recoat layer comprises UV hardening.

18. A method according to claim 11, wherein the step of removing the recoat layer further comprises agitating the cleansing solution with an impeller.

19. A method according to claim 11, wherein the cleansing solution further comprises a non-ionic surfactant solution.

20. A method according to claim 19, wherein the non-ionic surfactant solution comprises a polystyrene-b-poly(1,1-dihydroperfluorooctyl acrylate)copolymer.

21. An improved method of fabricating a micro-mechanical device, the method comprising:

depositing a first sacrificial layer on a substrate;

removing portions of the first sacrificial layer to define a first set of vias;

depositing a first metal layer on the first sacrificial layer;

removing portions of the first metal layer to define a set of first via supports;

depositing a second sacrificial layer on the first metal layer;

removing portions of the second sacrificial layer to define a second set of vias;

depositing a second metal layer on the second sacrificial layer;

removing portions of the second metal layer to define a set of second vias;

removing the first and second sacrificial layers by immersing the substrate in a cleansing solution comprising super-critical carbon dioxide and a solvent suitable to remove the sacrificial layers.

22. A method according to claim 21, wherein the solvent is selected from the group consisting of methanol, ethanol, ethyl acetate, methyl acetate, acetone, methylethylketone, or methyl tertiary-butyl ether.

23. A method according to claim 21, wherein the first and second sacrificial layers comprise a photoresist solution.

24. A method according to claim 23, wherein the photoresist solution comprises a mixture of novolac resin and a photoresist solvent.

25. A method according to claim 21, wherein the step of removing the sacrificial layers further comprises agitating the cleansing solution with an impeller.

26. A method according to claim 21, wherein the cleansing solution further comprises a non-ionic surfactant solution.

27. A method according to claim 26, wherein the non-ionic surfactant solution comprises a polystyrene-b-poly(1,1-dihydroperfluorooctyl acrylate)copolymer.

28. An improved method of fabricating a micro-mechanical device, the method comprising:

depositing a first sacrificial layer on a substrate;

removing portions of the first sacrificial layer to define a first set of vias;

depositing a first metal layer on the first sacrificial layer;

removing portions of the first metal layer to define a set of first via supports;

depositing a second sacrificial layer on the first metal layer;

removing portions of the second sacrificial layer to define a set of second via forms;

depositing a second metal layer on the second sacrificial layer;

removing portions of the second metal layer to define a set of second via supports;

recoating the micro-mechanical device with a recoat layer of sufficient thickness to completely encapsulate the micro-mechanical device;

curing the recoat layer;

removing the recoat layer by immersing the substrate in a cleansing solution comprising super-critical carbon dioxide and a solvent suitable to remove the recoat layer.

29. A method according to claim 28, wherein the solvent is selected from the group consisting of methanol, ethanol, ethyl acetate, methyl acetate, acetone, methylethylketone, or methyl tertiary-butyl ether.

30. A method according to claim 28, wherein the recoat layer comprises a mixture of novolac resin and a photoresist solvent.

31. A method according to claim 30, wherein the recoat layer does not contain a photoactive compound.

32. A method according to claim 28, wherein the step of curing the recoat layer comprises a hard bake.

33. A method according to claim 28, wherein the step of curing the recoat layer comprises a soft bake.

34. A method according to claim 28, wherein the step of curing the recoat layer comprises UV hardening.

35. A method according to claim 28, wherein the step of removing the sacrificial layer further comprises agitating the cleansing solution with an impeller.

36. A method according to claim 28, wherein the cleansing solution further comprises a non-ionic surfactant solution.

37. A method according to claim 36, wherein the non-ionic surfactant solution comprises a polystyrene-b-poly(1,1-dihydroperfluorooctyl acrylate)copolymer.