Manufacturing method of organic flat light-emitting devices

• US 20030124752A1
• Filed: 12/05/2002
• Published: 07/03/2003
• Est. Priority Date: 12/31/2001
• Status: Active Grant

• Current Assignee: III Holdings 1, LLC
• Original Assignee: RITDISPLAY CORPORATION
• Inventors: Wei, Mao-Kuo, Wang, Jih-Yi
• Granted Patent: US 6,924,160 B2
• Time in Patent Office: Days
• US Class Current: 438/22
• CPC Class Codes: H10K 50/858 comprising refractive means, e.g. lenses
• CPC Class Codes: H10K 59/879 comprising refractive means, e.g. lenses
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

This invention discloses a manufacturing method of organic flat light-emitting devices. The method includes the following steps. First, provide a transparent substrate, which has several microstructures on its first surface and the microstructures have a maximum height of 100μm from the first surface. Second, form a transparent anode on the second surface of the transparent substrate that is opposite to the first surface. Thirdly, form at least one organic electro-luminescent layer on the transparent anode. Finally, form a metal cathode on the organic electro-luminescent layer. The invention also provides another manufacturing method of organic flat light-emitting devices, which includes the steps of: forming a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures with a maximum height of 100 μm; forming a transparent anode on a second surface of the transparent substrate opposite to the first surface; forming at least one organic electro-luminescent layer; and forming a metal cathode on the organic electro-luminescent layer.

Claims

1. A manufacturing method of organic flat light-emitting devices, comprising the steps of:

providing a transparent substrate, which has a first surface and a second surface, the first surface being formed with a plurality of microstructures and the microstructures having a maximal height of 100 μ

m;

forming a transparent anode on the second surface of the transparent substrate;

forming at least an organic electro-luminescent layer; and

forming a metal cathode on the organic electro-luminescent layer.

2. The manufacturing method of claim 1, wherein the transparent substrate is a plastic substrate.

3. The manufacturing method of claim 1, wherein the transparent substrate is a flexible substrate.

4. The manufacturing method of claim 1, wherein the transparent substrate is formed by injection molding method.

5. The manufacturing method of claim 1, wherein the transparent substrate is formed by hot-embossing method.

6. The manufacturing method of claim 1, wherein the thickness of the transparent substrate is between 0.2 mm and 5 mm.

7. The manufacturing method of claim 1, wherein the microstructures have a curved surface.

8. The manufacturing method of claim 7, wherein the curved surface has a spherical shape with a diameter between 10 μ

m and 500 μ

m.

9. The manufacturing method of claim 7, wherein the curved surface has a cylindrical shape with a diameter between 10 μ

m and 500 μ

m and a length between 10 m and 500 μ

m.

10. The manufacturing method of claim 7, wherein the curved surface is a protruding surface having a square border with a side length between 10 μ

m and 500 μ

m.

11. A manufacturing method of organic flat light-emitting devices, comprising the steps of:

providing a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures and the microstructures having a maximum height of 100 μ

m;

forming a transparent anode on a second surface of the transparent substrate opposite to the first surface;

forming at least an organic electro-luminescent layer; and

forming a metal cathode on the organic electro-luminescent layer.

12. The manufacturing method of claim 11, wherein the transparent substrate is a plastic substrate.

13. The manufacturing method of claim 11, wherein the transparent substrate is a flexible substrate.

14. The manufacturing method of claim 11, wherein the transparent substrate is a glass substrate.

15. The manufacturing method of claim 11, wherein the thickness of the transparent substrate is between 0.2 mm and 5 mm.

16. The manufacturing method of claim 11, wherein the transparent thin film is formed on the first surface by an adhesive method.

17. The manufacturing method of claim 11, wherein the microstructures have a curved surface.

18. The manufacturing method of claim 17, wherein the curved surface has a spherical shape with a diameter between 10 μ

m and 500 μ

m.

19. The manufacturing method of claim 17, wherein the curved surface has a cylindrical shape with a diameter between 10 μ

m and 500 μ

m and a length between 10 μ

m and 500 μ

m.

20. The manufacturing method of claim 17, wherein the curved surface is a protruding surface having a square border with a side length between 10 μ

m and 500 μ

m.

21. The manufacturing method of claim 11, wherein the transparent thin film is formed by an adhering method.