Smart card web and a method for its manufacture

• US 20030127525A1
• Filed: 12/05/2002
• Published: 07/10/2003
• Est. Priority Date: 06/06/2000
• Status: Abandoned Application

• Current Assignee: Upm Raflatac Oy (UPM-Kymmene Oyj)
• Original Assignee: Rafsec Oy
• Inventors: Stromberg, Samuli
• Application Number:
  US10/310,699
• Publication Number:
  US 20030127525A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2310/0831 using UV radiation
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 37/206 Laminating a continuous layer between two continuous plastic layers
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06K 19/02 characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers

Abstract

The invention relates to a smart card web comprising a carrier web whose softening temperature is at least 110° C., preferably about 180° C., and a cover web whose softening temperature is not higher than 110° C. The invention also relates to a method for the manufacture of a smart card web. In the method, the smart card web is manufactured as a continuous web comprising a carrier web and a cover web attached to each other.

Claims

1. A smart card web comprising a carrier web including circuitry patterns and integrated circuits on chips, the carrier web having a softening temperature of at least 110°

C., and attached to the carrier web is at least on one side of the carrier web a cover web, wherein the cover web has a softening temperature which is not higher than 110°

C.

2. The smart card web according to claim 1, wherein it comprises a cover web on each side of the carrier web.

3. The smart card web according to claim 1, wherein the material of the carrier web is polyester, or polypropylene with biaxial orientation.

4. The smart card web according to claim 1, wherein the material of the cover web is polyvinyl chloride, acrylonitrile/butadiene/styrene copolymer, polycarbonate, polyethylene, or polypropylene.

5. The smart card web according to claim 4, wherein an integrated circuit is attached to the carrier web by flip-chip technology.

6. The smart card web according to claim 5, wherein the cover web is heat-sealable.

7. The smart card web according to claim 6, wherein the carrier web and the cover web are attached to each other by means of an adhesive.

8. The smart card web according to claim 7, wherein the adhesive can be subjected to transfer lamination.

9. A method for the manufacture of a smart card web in a continuous manner, the smart card web comprising a cover web and a carrier web including a circuitry pattern and an integrated circuit on a chip, wherein the integrated circuits on the chips are attached to the circuitry patterns formed on the surface of the carrier web in a temperature which exceeds 110°

C., and the cover web, which is made of a heat-sealable material is attached to the carrier web.

10. The method according to claim 9, wherein the integrated circuit on the chip is attached to the circuitry pattern by a flip-chip technology.

11. The method according to claim 9 or 10, wherein the integrated circuit on the chip is attached to the circuitry pattern on the same production line on which the carrier web and the cover web are attached to each other.

12. The method according to claim 9 or 10, wherein the integrated circuit on the chip is attached to the circuitry pattern on a production line different from the line on which the carrier web and the cover web are attached to each other.

13. The method according to claim 11, wherein the carrier web and the cover web are attached to each other by means of an adhesive that can be subjected to transfer lamination.

14. The method according to claim 13, wherein the adhesive is crosslinked by means of heat, radiation or eletromagnetic waves after the attachment of the carrier web and the liner web.

15. The method according to claim 14, wherein the adhesive is crosslinked by radiation by using ultraviolet radiation, curing by an electron beam, or microwave radiation.

16. The method according to claim 12, wherein the carrier web and the cover web are attached to each other by means of an adhesive that can be subjected to transfer lamination.

17. The method according to claim 16, wherein the adhesive is crosslinked by means of heat, radiation or eletromagnetic waves after the attachment of the carrier web and the liner web.

18. The method according to claim 17, wherein the adhesive is crosslinked by radiation by using ultraviolet radiation, curing by an electron beam, or microwave radiation.