Semiconductor component which emits radiation, and method for producing the same
First Claim
1. Radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face, and whose first principal face (2) adjoins the multilayered structure (4), with the window (1) having at least one recess (8) to form radiation-output surfaces running at an angle to the first principal face (2), characterized by the fact that at least one lateral face of the window and/or of the recess adjoining the second principal face (3) is provided, at least in part, with a first contact surface (11).
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Accused Products
Abstract
This invention describes a radiation-emitting semiconductor component with the a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face (2), and whose first principal face (2) adjoins the multilayered structure (4).
At least one recess (8) is made in the window (1), which preferably has the form of an indentation of the second principal face or as an edge excavation. At least one lateral surface of the window (1) or of the recess (8) is provided at least partially with a contact surface (11). Alternatively or cumulatively, at least one contact surface of the component has a plurality of openings (14).
68 Citations
61 Claims
- 1. Radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face, and whose first principal face (2) adjoins the multilayered structure (4), with the window (1) having at least one recess (8) to form radiation-output surfaces running at an angle to the first principal face (2), characterized by the fact that at least one lateral face of the window and/or of the recess adjoining the second principal face (3) is provided, at least in part, with a first contact surface (11).
- 5. Radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face and that adjoins the multilayered structure (4), with the window (1) having at least one recess (8) forming radiation-output surfaces at an angle to the first principal face (2), characterized by the fact that the multilayered structure (4) is provided at least partially with a contact surface (6) that has a plurality of openings (14).
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8. Radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face and whose first principal face (2) adjoins the multilayered structure (4), with the window (1) having at least one recess (8) forming radiation-output surfaces at an angle to the first principal face (2),
characterized by the fact that the second principal face (3) is provided at least partially with a contact surface (11) that has a plurality of openings (14).
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34. Method for manufacturing a radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face, and whose first principal face (2) adjoins the multilayered structure (4), with at least one recess (8) being formed in the window (1) and with at least one lateral surfaces of the window and/or or the recess being provided at least partially with a first contact surface (11), characterized by the steps
preparation of a window layer (20) with a first principal face (26) and a second principal face (27) opposite the first principal face application of a semiconductor layer sequence (21) to the first principal face (26) of the window layer (20) structuring the window layer (21), with at least one recess being produced in the second principal face (27) production of a contact surface (25) on the side of the second principal face (27) of the window layer (20), completion of the semiconductor component.
- 42. Radiation-emitting semiconductor component with a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that is positioned exclusively on the side of the multilayered structure (4) facing away from a principal direction of radiation of the semiconductor component and has at least one lateral wall (10) that has a lateral wall section (10a) that is inclined, concave, or stepped relative to a mid-axis of the semiconductor body perpendicular to the multilayered structure, which changes to a second lateral wall section (10b) perpendicular to the multilayered structure, i.e. parallel to the mid-axis, in its further extension toward the back when viewed from the multilayered structure (4), with the part of the window (1) encircling the second lateral wall section (10b) constituting a mounting base for the semiconductor component, characterized by the fact that the multilayered structure (4) is provided at least partially with a contact surface (6) that has a plurality of openings (14).
Specification