Semiconductor component and a method for identifying a semiconductor component

• US 20030127718A1
• Filed: 02/06/2003
• Published: 07/10/2003
• Est. Priority Date: 08/10/2000
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Haag, Frieder
• Granted Patent: US 6,750,479 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2223/54433 containing identification or tracking information
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/315 the encapsulation having a cavity
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

The invention concerns a semiconductor component and a method for identifying a semiconductor component that comprises at least one semiconductor substrate equipped with electronic/electromechanical components, which said semiconductor substrate—except for its leads—is embedded in a housing part made of plastic. It is proposed to equip the semiconductor substrate located in the housing part with an identifier located directly or indirectly thereon that makes it possible to distinguish the semiconductor component from other similarly-designed semiconductor components, and which can be read out from outside the housing part using ultrasound. In the case of semiconductor substrates produced in panels, the identifier makes it possible to determine the original position of the semiconductor substrate of a selected semiconductor component on a base substrate on which a plurality of semiconductor substrates were produced, even after the semiconductor substrates have been diced and placed in a housing part.

Claims

1. A semiconductor component comprising at least one semiconductor substrate (4) equipped with electronic/electromechanical components (13), which said semiconductor substrate—

except for its leads (11)—

is embedded in a housing part (8) made of plastic,

wherein the semiconductor substrate (4) located in the housing part (8) is equipped with an identifier (20) located directly or indirectly thereon that makes it possible to distinguish the semiconductor component (1) from other similarly-designed semiconductor components, and which can be read out from outside the housing part (8) using ultrasound.

2. The semiconductor component according to claim 1,

wherein the identifier (20) is formed by a pattern of recesses (21) in a surface section (15, 22) of the semiconductor substrate (4) or a component (5) located thereon.

3. The semiconductor component according to claim 2,

wherein the recesses (21) are produced by etching.

4. The semiconductor component according to claim 2,

wherein the interior walls of the recesses (21) are oblique relative to the surface section (15, 22).

5. The semiconductor component according to one of the claims 1 through 4, wherein the recesses (21) are formed on an inner side (22)—

facing the semiconductor substrate (4)—

of a cap piece (5) located on the semiconductor substrate (4), which said cap piece (5), together with the semiconductor substrate (4), forms a hollow space (6).

6. The semiconductor component according to claim 1,

wherein the identifier located on the semiconductor substrate or the component is formed by a pattern composed of a material layer or a layer system of various materials in which ultrasound propagates at a different speed than in the material of the semiconductor substrate or the component.

7. The semiconductor component according to claim 1,

wherein the housing part is made of a mold compound, and the identifier located on the semiconductor substrate or a component located thereon is formed by a pattern that is composed of a material to which the mold compound adheres more poorly than to the material of the semiconductor substrate or the component.

8. The semiconductor component according to claim 7,

wherein the identifier is formed by a pattern of silver spots.

9. The semiconductor component according to claim 1,

wherein the housing part is made of a mold compound, and the identifier located on the semiconductor substrate or a component located thereon is formed by a pattern that is composed of a material to which the mold compound adheres better than to the material of the semiconductor substrate or the component.

10. The semiconductor component according to claim 9,

wherein the identifier on the semiconductor component is formed by means of a pattern of polyimide spots.

11. A method for identifying a semiconductor component that comprises at least one semiconductor substrate (4) equipped with electronic/electromechanical components (13) that is produced on a panel together with a plurality of further semiconductor substrates (4) on a common base substrate (7), whereby the semiconductor substrates (4), after manufacture, are diced and placed on a lead frame (11, 12) and, finally, are enclosed in a housing part—

(8)except for their respective leads (11)—

made of plastic,

wherein, before dicing, all semiconductor substrates (4) on the panel are equipped with an identifier (20)—

directly or indirectly on the semiconductor substrate—

identifying the position of the respective semiconductor substrate on the base substrate (7), and the identifier (20) of a selected semiconductor substrate (4′

), after dicing and placement in the housing part (8), is read out using an ultrasonic device from outside the housing part (8) to identify the semiconductor element (1).

12. The method according to claim 11,

wherein an ultrasonic microscope is used as the ultrasonic device.